MBH7BT08

www.DataSheet4U.com Bluetooth Module MBH7BT08 Data Sheet Rev. 0.05e 20 October 2002 FUJITSU MEDIA DEVICES LIMITED All specifications are preliminary which may be changed without any prior notice Copyright © FUJITSU MEDIA DEVICES LIMITED 2002 -1- 1. Introduction This document applies to the Bluetooth Class 2 module MBH7BT08. 2. Features MBH7BT08 is a Power Class 2 module conforming to Bluetooth Specification Version 1.1. MBH7BT08 transmits and receives in the 2.4 GHz ISM band. Although upper layer protocol stack and Profiles have to be embedded on the user's host system when user uses conventional HCI module, MBH7BT08 includes upper layer protocol stack and several Profiles. Therefore, MBH7BT08 makes it possible to reduce the resources of the user's host system required to process for Bluetooth. MBH7BT08 has the following features: Bluetooth Specification Version 1.1 Compliant Built-in upper layer protcol stack (L2CAP, SDP, RFCOMM) Built-in profiles (GAP, SDAP, SPP) Transmit Power Class 2 (+4 dBm max.) Hardware interface: UART interface (up to 921.6 kbps) Software interface: Zerial interface (AT command-like) 3.3 ± 0.3 V Operation Bluetooth Qualification Program approved (planned) Microminiature: 19.5 x 13 x 2.2 mm Surface mount type 3. Block Diagram 12MHz Crystal UART 32kHz Crystal Zeevo Bluetooth Chip Antenna Port Copyright © FUJITSU MEDIA DEVICES LIMITED 2002 -2- 4. Electrical Characteristics 4-1. General Specification Bluetooth™ Specific...