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NSR0230P2T5G Dataheets PDF



Part Number NSR0230P2T5G
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Schottky Barrier Diode
Datasheet NSR0230P2T5G DatasheetNSR0230P2T5G Datasheet (PDF)

www.DataSheet4U.com NSR0230P2T5G Schottky Barrier Diode These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited. Features http://onsemi.com • • • • Extremely Fast Switching Speed Extremely Low Forward Voltage 0.325 V (max) @ IF = 10 mA Low Reverse Current This is a.

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www.DataSheet4U.com NSR0230P2T5G Schottky Barrier Diode These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited. Features http://onsemi.com • • • • Extremely Fast Switching Speed Extremely Low Forward Voltage 0.325 V (max) @ IF = 10 mA Low Reverse Current This is a Pb−Free Device 30 V SCHOTTKY BARRIER DIODE MAXIMUM RATINGS Rating Reverse Voltage Forward Current DC Forward Current Surge Peak (60 Hz, 1 cycle) ESD Rating: Class 3B per Human Body Model ESD Rating: Class C per Machine Model Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Symbol VR IF IFSM Value 30 200 1.0 Unit Vdc mA 2 A 1 CATHODE 2 ANODE MARKING DIAGRAM 1 K MG G SOD−923 CASE 514AA PLASTIC 1 2 THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR−5 Board, (Note 1) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range 1. FR−5 Minimum Pad. Symbol PD Max 200 2.0 RqJA TJ, Tstg 600 −55 to +125 Unit mW mW/°C °C/W °C K = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device NSR0230P2T5G Package SOD−923 Shipping† 2 mm Pitch 8000/Tape & Reel ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Reverse Leakage (VR = 10 V) Forward Voltage (IF = 10 mA) (IF = 200 mA) Symbol IR VF − − − − 0.325 0.500 Min − Typ − Max 10 Unit mA Vdc †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2006 1 October, 2006 − Rev. 0 Publication Order Number: NSR0230P2/D www.DataSheet4U.com NSR0230P2T5G 1 IF, FORWARD CURRENT (A) TA = 125°C IR, REVERSE CURRENT (A) TA = 75°C 100m 10m 1m 100m 10m 1m 0 0.1 0.2 TA = −25°C 0.3 0.4 0.5 0.6 10m 1m 100m 10m 1m 100n 10n 1n 0 5 10 15 20 25 30 VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (VOLTS) TA = −25°C TA = 75°C TA = 25°C TA = 125°C TA = 25°C Figure 1. Forward Characteristics Figure 2. Reverse Characteristics 20 CT, TOATAL CAPACITANCE (pF) 18 16 14 12 10 8 6 4 2 0 0 5 10 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Total Capacitance http://onsemi.com 2 www.DataSheet4U.com NSR0230P2T5G PACKAGE DIMENSIONS SOD−923 CASE 514AA−01 ISSUE B D −X− −Y− E 1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS MIN NOM MAX 0.36 0.40 0.43 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.05 0.10 0.15 INCHES NOM 0.016 0.008 0.005 0.031 0.024 0.039 0.004 b 2X 0.08 (0.0032) X Y A c L HE DIM A b c D E HE L MIN 0.014 0.006 0.003 0.030 0.022 0.037 0.002 MAX 0.017 0.010 0.007 0.033 0.026 0.041 0.006 SOLDERING FOOTPRINT* 0.90 0.40 0.30 DIMENSIONS: MILLIMETERS SOD−923 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, .


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