WSF512K32-XXX

www.DataSheet4U.com White Electronic Designs 512KX32 SRAM / FLASH MODULE FEATURES Access Times of 25ns (SRAM) and 70, 90ns (FLASH) Packaging 66 pin, PGA Type, 1.385" square HIP, Hermetic Ceramic HIP (Package 402) 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880") square (Package 509) 4.57mm (0.180") height. Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Figure 2). Package to be developed. 512Kx32 SRAM 512Kx32 5V Flash Organized as 512Kx32 of SRAM and 512Kx32 of Flash Memory with common Data Bus Low Power CMOS Commercial, Industrial and Military Temperature Ranges TTL Compatible Inputs and Outputs WSF512K32-XXX Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation Weight - 13 grams typical FLASH MEMORY FEATURES 100,000 Erase/Program Cycles Sector Architecture 8 equal size sectors of 64KBytes each Any combination of sectors can be concurrently erased. Also supports full chip erase 5 Volt Programming; 5V ± 10% Supply Embedded Erase and Program Algorithms Hardware Write Protection Page Program Operation and Internal Program Control Time. * This product is subject to change without notice. Note: Programming information available upon request. Figure 1 – PIN CONFIGURATION FOR WSF512K32-29H2X Top View 1 I/O8 I/O9 I/O10 A14 A16 A11 A0 A18 I/O0 I/O1 I/O2 11 22 12 FWE2# SWE2# GND I/O11 A10 A9 A15 VCC FCS# SCS# I/O3 33 23 I/O15 I/O14 I/O13 I/O12 OE# A17 FWE1# I/O7 I/O6 I/O5 I/O4 I/O24 I/O25 I/O26 A7 A12 SWE1# A13 A8 I/O16 I/O17 I/O18 44 34 VCC SWE4# FWE4...