Document
www.DataSheet4U.com
ZMD31010
RBicLiteTM Low-Cost Sensor Signal Conditioner
Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY
ZMD31010 RBicLite™ Technical Notes
Die Dimensions and Pad Coordinates
Contents
1 2 3 RBICLITE™ DIE DIMENSIONS..................................................................................................................... 2 RBICLITE™ PAD COORDINATES ............................................................................................................... 3 RELATED DOCUMENTS............................................................................................................................ 4
Preliminary Tech. Notes – Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005
Page 1 of 4
© ZMD AG, 2005
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31010
RBicLiteTM Low-Cost Sensor Signal Conditioner
Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY
1
RBicLite™ Die Dimensions
• • • • • Die size (including scribeline): 2230 µm x 1681 µm ≈ 3.75sqmm Core die size (without scribeline): Die thickness: 390µm Scribeline (distance between two core dice on wafer): 150µm Pads size: 68µm x 68µm 2080 µm x 1531 µm ≈ 3.19 sqmm
Preliminary Tech. Notes – Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005
Page 2 of 4
© ZMD AG, 2005
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31010
RBicLiteTM Low-Cost Sensor Signal Conditioner
Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY
2
RBicLite™ Pad Coordinates
All pads coordinates are for pad centers and related to the corner.
Name
bsink por_n vbp vdd vbn vss vssa vpp sig_pd vdd vgate
X Coordinate in µ
106.3 1109.7 1210.0 1389.3 1568.1 107.2 198.3 356.1 1428.6 1672.3 1809.2
Y Coordinate in µ
85.9 85.9 85.9 77.3 85.9 1444.7 1444.7 1444.7 1444.7 1435.8 1444.7
Preliminary Tech. Notes – Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005
Page 3 of 4
© ZMD AG, 2005
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice.
ZMD31010
RBicLiteTM Low-Cost Sensor Signal Conditioner
Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY
3
• • • •
Related Documents
ZMD31010 RBicLite Datasheet ZMD31010 RBicLiteTM Development Kit Documentation ZMD31010 RBicLiteTM Errata Sheet TM ZMD31010 RBicLite Application Notes – In-Circuit Programming B.