DatasheetsPDF.com

ZMD31010 Dataheets PDF



Part Number ZMD31010
Manufacturers Zentrum Mikroelektronik Dresden
Logo Zentrum Mikroelektronik Dresden
Description RBicLite Low-Cost Sensor Signal Conditioner
Datasheet ZMD31010 DatasheetZMD31010 Datasheet (PDF)

www.DataSheet4U.com ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY ZMD31010 RBicLite™ Technical Notes Die Dimensions and Pad Coordinates Contents 1 2 3 RBICLITE™ DIE DIMENSIONS.. 2 RBICLITE™ PAD COORDINATES ...

  ZMD31010   ZMD31010



Document
www.DataSheet4U.com ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY ZMD31010 RBicLite™ Technical Notes Die Dimensions and Pad Coordinates Contents 1 2 3 RBICLITE™ DIE DIMENSIONS..................................................................................................................... 2 RBICLITE™ PAD COORDINATES ............................................................................................................... 3 RELATED DOCUMENTS............................................................................................................................ 4 Preliminary Tech. Notes – Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005 Page 1 of 4 © ZMD AG, 2005 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY 1 RBicLite™ Die Dimensions • • • • • Die size (including scribeline): 2230 µm x 1681 µm ≈ 3.75sqmm Core die size (without scribeline): Die thickness: 390µm Scribeline (distance between two core dice on wafer): 150µm Pads size: 68µm x 68µm 2080 µm x 1531 µm ≈ 3.19 sqmm Preliminary Tech. Notes – Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005 Page 2 of 4 © ZMD AG, 2005 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY 2 RBicLite™ Pad Coordinates All pads coordinates are for pad centers and related to the corner. Name bsink por_n vbp vdd vbn vss vssa vpp sig_pd vdd vgate X Coordinate in µ 106.3 1109.7 1210.0 1389.3 1568.1 107.2 198.3 356.1 1428.6 1672.3 1809.2 Y Coordinate in µ 85.9 85.9 85.9 77.3 85.9 1444.7 1444.7 1444.7 1444.7 1435.8 1444.7 Preliminary Tech. Notes – Die Dim. & Pad Coordinates, Rev. A/0.3, April 19, 2005 Page 3 of 4 © ZMD AG, 2005 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The Information furnished in this publication is preliminary and subject to changes without notice. ZMD31010 RBicLiteTM Low-Cost Sensor Signal Conditioner Technical Notes – Die Dimensions and Pad Coordinates PRELIMINARY 3 • • • • Related Documents ZMD31010 RBicLite Datasheet ZMD31010 RBicLiteTM Development Kit Documentation ZMD31010 RBicLiteTM Errata Sheet TM ZMD31010 RBicLite Application Notes – In-Circuit Programming B.


VTB6061BH ZMD31010 ZMD31020


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)