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CMM3030-BD
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CMM3030-BD
Advanced Product Information February 2002 (1 of 2)
30 kHz to 30 GHz GaAs MMIC Optical Modulator Driver Amplifier
Features ❏ Small Size ❏ High Gain: 9 dB Typical ❏ Output Voltage up to 7.5 V Peak-to-Peak ❏ 30 kHz to 30 GHz Bandwidth ❏ Low Gain Ripple: 1.0 dB pp Typical ❏ Sub 0.25 Micron PHEMT Applications ❏ Driver Amplifier for LiNb03 Modulator @ OC192 bit rate SONET/SHD Transmission Systems ❏ Medium Power Linear Gain Block for Broadband Systems Description
The CMM3030-BD is a precision GaAs MMIC, medium power amplifier and is part of Celeritek’s family of WideFiber™ products. The CMM3030-BD optical driver amplifier gives fiber optic system designers a unique combination of wideband frequency coverage, along with a flat response and very low internal jitter. It is a precision PHEMT GaAs MMIC medium power amplifier with +23 dBm @ P1dB. It operates from 30 kHz to 30 GHz with a 9 dB linear gain. Low internal jitter makes it especially well suited for high speed digital
Chip Diagram
Units in Microns
data applications. Maximum output voltage is 7.5 V peak-topeak. It is an excellent choice as a driver amplifier for Lithium Niobate (Mach-Zehnder) external optical modulators, to achieve high extinction ratio. Targeted for OC-192/STM64 metropolitan and long-haul dense wave-division multiplexed optical networking applications and other high speed applications. The bit rate can be as high as 15 Gb/s to provide overhead for forward error-correction algorithms. The bias voltage can be adjusted to reduce the output voltage as needed. CMM3030-BD amplifiers are shipped in Gel Pack from Celeritek’s foundry.
Specifications (TA = 25°C, VDD = 8V) (On-Wafer Probe)
Parameters Units Min Typ Max
Frequency Range Small Signal Gain Gain Flatness Input/Output VSWR Power Output (@1 dB Gain Compression) @ 12 GHz Second Order Intercept Point @ 12 GHz Third Order Intercept Point @ 12 GHz Current
— dB ±dB — dBm dBm dBm mA
30 kHz 8.0
30.0 GHz 9.0 0.5 1.8:1 24.0 40.0 30.0 275 0.75 2.0:1
22.0
350
3236 Scott Boulevard
Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
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CMM3030-BD
Absolute Maximum Ratings
Parameter Rating
Advanced Product Information - February 2002
(2 of 4)
Die Attach and Bonding Procedures
12 V -5 V 375 mA 3.0 W +175°C -65°C to +175°C +320°C +23 dBm
Die Attach: Eutectic die attach is recommended. For eutectic die attach: Preform: AuSn (80% Au, 20% Sn); Stage Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1 min or less. Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (prestressed); Thermocompression bonding is preferred over thermosonic bonding. For thermocompression bonding: Stage.