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QFP-SD

STATS ChipPAC
Part Number QFP-SD
Manufacturer STATS ChipPAC
Description Stacked Die Quad Flat Pack
Published Oct 23, 2006
Detailed Description www.DataSheet4U.com QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a...
Datasheet PDF File QFP-SD PDF File

QFP-SD
QFP-SD

Overview
www.
DataSheet4U.
com QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES • Combining devices into one package reduces PCB real estate and cost • Increased sub-system performance by integrating multiple chips into a single package • Die to die bonding capability for device/signal integration • Standard and green/lead-free materials and Pb-free plating • Options for mixed technologies, 2 or more stacked dice • Fine pitch bonding capability • Exposed pad provides enhanced thermal performance • Low profile package thickness of 1.
40mm (LQFP-SD and LQFP-ep-SD); 1.
00mm (TQFP-ep-SD) • Lead pitch ranges from 0.
80mm to ...


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