DatasheetsPDF.com

QFP-EP

STATS ChipPAC
Part Number QFP-EP
Manufacturer STATS ChipPAC
Description Exposed Pad Quad Flat Pack
Published Oct 23, 2006
Detailed Description www.DataSheet4U.com QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead p...
Datasheet PDF File QFP-EP PDF File

QFP-EP
QFP-EP

Overview
www.
DataSheet4U.
com QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.
80mm to 0.
40mm FEATURES • Body Sizes: 7 x 7mm to 24 x 24mm • Package Height: 1.
0mm (TQFP-ep) and 1.
4mm (LQFP-ep) • Lead Counts: 32L to 216L • Lead Pitch: 0.
40mm to 0.
80mm • Wide range of open tool leadframe and die pad sizes available • JEDEC standard compliant • Lead-free and Green material sets available DESCRIPTION STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package.
Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal an...


Similar Datasheet


Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)