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CERAMIC CHIP/MIL-PRF-55681
CAPACITOR OUTLINE DRAWINGS
CHIP DIMENSIONS “SOLDERGUARD I” * SOLDER “SOLDERGUARD II” TINNED
W T
L
BW
NICKEL ELECTRODES SILVER METALLIZATION ELECTRODES
NICKEL SILVER METALLIZATION
Military Designation - “S” or “U” KEMET Designation - “H”
Military Designation - “W” or “Y” KEMET Designation - “C”
DIMENSIONS—MILLIMETERS AND (INCHES)
STYLE KEMET SIZE CODE T L W MIN. MAX. BW
CDR01 CDR02 CDR03 CDR04 CDR05 CDR06 CDR31 CDR32 CDR33 CDR34 CDR35
C0805 C1805 C1808 C1812 C1825 C2225 C0805 C1206 C1210 C1812 C1825
2.03 ±.38 (.080 ±.015) 4.57 ±.38 (.180 ±.015) 4.57 ±.38 (.180 ±.015) 4.57 ±.38 (.180 ±.015) +.51 +.020 4.57 .180 –.38 –.015 5.72 ±.51 (.225 ±.020) 2.00 ±.20 (.078 ±.008) 3.20 ±.20 (.125 ±.008) 3.20 ±.25 (.125 ±.010) 4.50 ±.25 (.176 ±.010) 4.50 ±.30 (.176 ±.012)
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1.27 ±.38 (.050 ±.015) 1.27 ±.38 (.050 ±.015) 2.03 ±.38 (.080 ±.015) 3.18 ±.38 (.125 ±.015) +.51 +.020 6.35 .250 –.38 –.015 6.35 ±.51 (.250 ±.020) 1.25 ±.20 (.049 ±.008) 1.60 ±.20 (.062 ±.008) 2.50 ±.25 (.098 ±.010) 3.20 ±.25 (.125 ±.010) 6.40 ±.30 (.250 ±.012)
.56 (.022) .56 (.022) .56 (.022) .56 (.022) .51 (.020) .51 (.020)
1.40 (.055) 1.40 (.055) 2.03 (.080) 2.03 (.080) 2.03 (.080) 2.03 (.080) 1.30 (.051) 1.30 (.051) 1.50 (.059) 1.50 (.059) 1.50 (.059)
.51 ± 0.25 (.020 ±.010) .51 ± 0.25 (.020 ±.010) .51 ± 0.25 (.020 ±.010) .51 ± 0.25 (.020 ±.010) .51 ± 0.25 (.020 ±.010) .51 ± 0.25 (.020 ±.010) .50 ± 0.20 (.020 ±.008) .50 ± 0.20 (.020 ±.008) .50 ± 0.25 (.020 ±.010) .50 ± 0.25 (.020 ±.010) .50 ± 0.30 (.020 ±.012)
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Note: For Solderguard I (MIL-C55681 “S” or “U” Endmets), the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following amounts: Length Width/Thickness CDR01 0.51MM (.020) 0.38MM (.015) CDR02-06 0.64MM (.025) 0.38MM (.015) CDR31-35 0.60MM (.023) 0.30MM (.012)
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01 B P 101 B K S M
STYLE & SIZE CODE
STYLE C — Ceramic D — Dielectric, Fixed Chip R — Established Reliability
FAILURE RATE LEVEL (%/1000 hrs.)
M — 1.0 P — 0.1 R — 0.01 S — 0.001 W — Base Metalization— Barrier Metal—Tinned Tin or (Tin/Lead Alloy) SolderGuard II Y — Base Metalization Barrier Metal—Tinned (100% Tin) Solderguard II
TERMINATION FINISH
S — Solder Coated, Final (SolderGuard I) U — Base Metalization— Barrier Metal—Solder Coated (SolderGuard I)
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE X —± 15%—without voltage + 15%, –25%—with voltage
CAPACITANCE
Expressed in picofarads (pF). First 2 digits represent significant figures and the last digit specifies the number of zeros to follow. (Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
CAPACITANCE TOLERANCE
B C D F ±.1 pF ±.25 pF ±.5 pF ±1% J ±5% K M ±10% ±20%
RATED VOLTAGE
A — 50; B — 100
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805 P 101 K 1 G M C*
CERAMIC SIZE CODE
See Table Above
END METALIZATION
C — SolderGuard II (Military equiv.