FDFMA2P853 Integrated P-Channel PowerTrench® MOSFET and Schottky Diode
FDFMA2P853
July 2014
Integrated P-Channel Powe...
FDFMA2P853 Integrated P-Channel PowerTrench® MOSFET and
Schottky Diode
FDFMA2P853
July 2014
Integrated P-Channel PowerTrench® MOSFET and
Schottky Diode
General Description
This device is designed specifically as a single package solution for the battery charge switch in cellular handset and other ultra-portable applications. It features a MOSFET with low on-state resistance and an independently connected low forward voltage
schottky diode for minimum conduction losses.
The MicroFET 2x2 package offers exceptional thermal perfo rmance for it's physlicsaize and is well suited to linear mode applications.
Features
MOSFET:
-3.0 A, -20V. RDS(ON) = 120 m: @ VGS = -4.5 V RDS(ON) = 160 m: @ VGS = -2.5 V RDS(ON) = 240 m: @ VGS = -1.8 V
Schottky:
VF < 0.46 V @ 500 mA
Low Profile - 0.8 mm maximun - in the new package MicroFET 2x2 mm
RoHS Compliant
A NC D
C
D
A1 NC 2
D3
MicroFET C G S
Absolute Maximum Ratings TA = 25°C unless otherwise noted
Symbol VDSS VGSS
ID
Parameter MOSFET Drain-Source Voltage MOSFET Gate-Source Voltage
Drain Current -Continuous -Pulsed
(Note 1a)
VRRM IO
PD
Schottky Repetitive Peak Reverse voltage
Schottky Average Forward Current
Power dissipation for Single Operation Power dissipation for Single Operation
(Note 1a)
(Note 1a) (Note 1b)
TJ, TSTG Operating and Storage Junction Temperature Range
Thermal Characteristics
RTJA RTJA RTJA RTJA
Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junct...