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DIM100PHM33-A000

Dynex Semiconductor

IGBT Power Module

www.DataSheet4U.com DIM100PHM33-A000 DIM100PHM33-A000 Half Bridge IGBT Module PDS5708-1.3 January 2004 FEATURES I I I...


Dynex Semiconductor

DIM100PHM33-A000

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www.DataSheet4U.com DIM100PHM33-A000 DIM100PHM33-A000 Half Bridge IGBT Module PDS5708-1.3 January 2004 FEATURES I I I I KEY PARAMETERS VCES VCE(sat) * IC IC(PK) (typ) (max) (max) 3300V 3.4V 100A 200A 10µs Short Circuit Withstand High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN Substrates *(measured at the power busbars and not the auxiliary terminals) APPLICATIONS I I I 1(E1/C2) 2(C1) 5(E1) 4(G1) 3(E2) 7(E2) 6(G2) High Reliability Inverters Motor Controllers Traction Auxiliaries The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up to 3600A. The DIM100PHM33-A000 is a half bridge 3300V, DataSheet4U.com n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) plus full 10µs short circuit withstand. This device is optimised for applications requiring high thermal cycling capability. The module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. 8(C1) DataShee Fig. 1 Half bridge circuit diagram ORDERING INFORMATION Order As: DIM100PHM33-A000 Note: When ordering, please use the whole part number. Outline type code: P (See package details for further information) Fig. 2 Electrical connections - (not to s...




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