Document
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS10
CMS10
Switching Mode Power Supply Applications Portable Equipment Battery Applications
Unit: mm
• Forward voltage: VFM = 0.55 V (max) • Average forward current: IF (AV) = 1.0 A • Repetitive peak reverse voltage: VRRM = 40 V • Suitable for compact assembly due to small surface-mount package
“M−FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
(Note 1)
VRRM IF (AV)
40
1.0 (Ta = 21°C)
V A
Peak one cycle surge forward current (non-repetitive)
IFSM
25 (50 Hz)
A
Junction temperature Storage temperature
Tj
−40~150
°C
Tstg
−40~150
°C
JEDEC JEITA
― ―
Note 1: Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm, soldering land: 6 mm × 6 mm)
Note 2: Using continuously under heavy loads (e.g. the application of
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics Peak forward voltage
Repetitive peak reverse current Junction capacitance Thermal resistance Thermal resistance
Symbol VFM (1) VFM (2) VFM (3) IRRM IRRM
Cj
Rth (j-a)
Rth (j-ℓ)
Test Condition
IFM = 0.1 A IFM = 0.5 A IFM = 1.0 A VRRM = 5 V VRRM = 40 V VR = 10 V, f = 1.0 MHz Device mounted on a ceramic board (soldering land: 2 mm × 2 mm) Device mounted on a glass-epoxy board (soldering land: 6 mm × 6 mm)
⎯
Min ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯
⎯
⎯
Typ. Max Unit
0.34 0.41 0.47 1.0 8.0 50
⎯ ⎯ 0.55 ⎯ 500 ⎯
V
μA pF
⎯ 60
°C/W ⎯ 135
⎯ 16 °C/W
Start of commercial production
2000-07 1 2013-11-01
Marking
Abbreviation Code S0
Part No. CMS10
Standard Soldering Pad
Unit: mm
CMS10
2.1
1.4 3.0
1.4
Handling Precaution
Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage. Please take forward and reverse loss into consideration during design.
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device.
VRRM: Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account designing a device at low temperature.
IF(AV):
We recommend that the worst case current be no greater than 80% of the absolute maximum rating
of IF(AV) and Tj be below 120°C. When using this device, take the margin into consideration by using an allowable Tamax-IF(AV) curve.
IFSM: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
Tj: Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a Tj of below 120°C.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
2 2013-11-01
Instantaneous forward current iF (A)
iF – vF
10
Tj = 150°C 125°C 75°C 1
25°C
0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
Instantaneous forward voltage vF (V)
Ta max – IF (AV) Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm, land size 6 mm × 6 mm)
160 Rectangular waveform
140
120
DC 0° α 360°
100 IF (AV)
α = 180°
Conduction angle: α
80
α = 120°
VR = 20 V
60
40 α = 60°
20
0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current IF (AV) (A)
Maximum allowable lead temperature Ta max (°C)
Average forward power dissipation PF (AV) (W)
CMS10
PF (AV) – IF (AV)
0.8 Rectangular
waveform 0.7
DC
0.6 0° α 360°
0.5 Conduction angle: α
α = 180° α = 120°
0.4 α = 60°
0.3
0.2
0.1
0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current IF (AV) (A)
Ta max – IF (AV) Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
160
140
120
100 α = 60°
80 Rectangular waveform
60
DC
α = 180° α = 120°
40 0° α 360°
20 IF (AV) Conduction angle: α
0 VR = 20 V 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
Average forward current IF (AV) (A)
1.6
Maximum allowable ambient temperature Ta max (°C)
Transient thermal impedance rth (j-a) (°C/W)
500 100
1.