Document
TD62301,302P/F
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62301P,TD62301F,TD62302P,TD62302F
7CH LOW SATURATION SINK DRIVER
The TD62301P / F and TD62302P / F are comprised of seven NPN low saturation drivers. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and LED drive in low voltage system.
FEATURES
l Low saturation output VCE (sat) = 0.7 V (Max.) l Output rating (single output) 15 V (Min.) / 200 mA (Max.) l High DC transfer ratio 1000 (Min.) l Output clamp diodes l Input register : TD62301P / F R1 = 2 kΩ, R2 = 20 kΩ
: TD62302P / F R1 = 8.4 kΩ, R2 = 15 kΩ l Inputs compatible with TTL and 3~6 V CMOS l Package type−P : DIP−16 pin l Package type−F : SOP−16 pin
PIN CONNECTION (TOP VIEW)
Weight DIP16−P−300−2.54A : 1.11 g (Typ.) SOP16−P−225−1.27 : 0.16 g (Typ.)
SCHEMATICS (EACH DRIVER)
Note: The input and output parasitic diodes cannot be used as clamp diodes.
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MAXIMUM RATINGS (Ta = 25°C)
TD62301,302P/F
CHARACTERISTICS
SYMBOL
RATING
UNIT
Supply Voltage
Output Sustaining Voltage
Output Current
Input Voltage
Input Current
Clamp Diode Reverse Voltage
Clamp Diode Forward Current
Power Dissipation
P F
Operating Temperature
P F
Storage Temperature
VCC VCE (SUS)
IOUT VIN IIN VR IF
PD
Topr
Tstg
−0.5~15 −0.5~VCC + 0.5
200 −0.5~15
15 15 200 1.0 0.625 (Note) −30~75 −40~85 −55~150
V V mA / ch V mA V mA
W
°C
°C
Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C and Ta = −30~75°C for only Type−P)
CHARACTERISTIC
SYMBOL
CONDITION
Supply Voltage
Output Current
P
Input Voltage
Clamp Diode Reverse Voltage
Clamp Diode Forward Current
Power Dissipation
P F
VCC
IOUT
VIN VR IF PD
DC 1 Circuit
Tpw = 25 ms, Duty = 50%, 4 Circuits
Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
MIN TYP. MAX UNIT
3―6 V
0 ― 180 mA
0 ― 150
(Note)
― ― ― ― ―
― VCC V ― VCC V ― 180 mA ― 0.44
W ― 0.325
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ELECTRICAL CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC Output Leakage Current
Output Saturation Voltage
DC Current Transfer Ratio
Input
Output
Current On
TD62301P / F TD62302P / F
Input
Output
Voltage On
TD62301P / F TD62302P / F
Clamp Diode Forward Voltage
SYMBOL ICEX
VCE (sat) hFE
IIN (ON)
TEST CIR− CUIT
TEST CONDITION
VCC = 6 V, VOUT = 6 V, Ta = 50°C 1 VCC = 6 V, VOUT = 6 V, Ta = 25°C
VCC = 5 V, IIN = 0.14 mA 2 IOUT = 70 mA
VCC = 5 V, IIN = 0.3 mA IOUT = 150 mA
2
VCC = 5 V, VOUT = 2 V IOUT = 120 mA
3
VCC = 5 V, VIN = 2.4 V IOUT = 120 mA
VIN (ON) VF
4
VCC = 5 V, IIN = 0.2 mA IOUT = 120 mA
5 IF = 120 mA
Supply Current
ICC 6 IF = 120 mA
Input Capacitance Turn−On Delay Turn−Off Delay
CIN tON tOFF
― VIN = 0, f = 1 MHz
7
VCC = 6 V, RL=33 Ω CL = 15 pF
TD62301,302P/F
MIN TYP. MAX UNIT
―― 7 µA
―― 1
― ― 0.5 V
― ― 0.7
1000 2000 ―
― ― 0.60 mA
― ― 0.14
― ― 2.3 V
― ― 4.0
― ― 2.0 V
―
15
22
mA / Gate
― 15 ― pF
― 0.1 ― µs
― 0.2 ― µs
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TEST CIRCUIT 1. ICEX
2. hFE, VCE (sat)
TD62301,302P/F
3. IIN (ON)
4. VIN (ON) 7. tON, tOFF
5. VF
6. ICC
Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance.
PRECAUTIONS for USING
This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
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TD62301,302P/F
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PACKAGE DIMENSIONS
DIP16−P−300−2.54A
TD62301,302P/F
Unit : mm
Weight: 1.11 g (Typ.)
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PACKAGE DIMENSIONS
SOP16−P−225−1.27
TD62301,302P/F
Unit : mm
Weight: 0.16 g (Typ.)
7 2001-06-28
TD62301,302P/F
RESTRICTIONS ON PRODUCT USE
000707EBA
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applicati.