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TD62301 Dataheets PDF



Part Number TD62301
Manufacturers Toshiba Semiconductor
Logo Toshiba Semiconductor
Description (TD62301 / TD62302) 7CH LOW SATURATION SINK DRIVER
Datasheet TD62301 DatasheetTD62301 Datasheet (PDF)

TD62301,302P/F TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62301P,TD62301F,TD62302P,TD62302F 7CH LOW SATURATION SINK DRIVER The TD62301P / F and TD62302P / F are comprised of seven NPN low saturation drivers. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and LED drive in low voltage system. FEATURES l Low saturation output VCE (sat) = 0.7 V (Max.) l Output rating (single output) 15 V (Min.) / 200 mA (Max.) l Hi.

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TD62301,302P/F TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62301P,TD62301F,TD62302P,TD62302F 7CH LOW SATURATION SINK DRIVER The TD62301P / F and TD62302P / F are comprised of seven NPN low saturation drivers. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and LED drive in low voltage system. FEATURES l Low saturation output VCE (sat) = 0.7 V (Max.) l Output rating (single output) 15 V (Min.) / 200 mA (Max.) l High DC transfer ratio 1000 (Min.) l Output clamp diodes l Input register : TD62301P / F R1 = 2 kΩ, R2 = 20 kΩ : TD62302P / F R1 = 8.4 kΩ, R2 = 15 kΩ l Inputs compatible with TTL and 3~6 V CMOS l Package type−P : DIP−16 pin l Package type−F : SOP−16 pin PIN CONNECTION (TOP VIEW) Weight DIP16−P−300−2.54A : 1.11 g (Typ.) SOP16−P−225−1.27 : 0.16 g (Typ.) SCHEMATICS (EACH DRIVER) Note: The input and output parasitic diodes cannot be used as clamp diodes. 1 2001-06-28 MAXIMUM RATINGS (Ta = 25°C) TD62301,302P/F CHARACTERISTICS SYMBOL RATING UNIT Supply Voltage Output Sustaining Voltage Output Current Input Voltage Input Current Clamp Diode Reverse Voltage Clamp Diode Forward Current Power Dissipation P F Operating Temperature P F Storage Temperature VCC VCE (SUS) IOUT VIN IIN VR IF PD Topr Tstg −0.5~15 −0.5~VCC + 0.5 200 −0.5~15 15 15 200 1.0 0.625 (Note) −30~75 −40~85 −55~150 V V mA / ch V mA V mA W °C °C Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%) RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C and Ta = −30~75°C for only Type−P) CHARACTERISTIC SYMBOL CONDITION Supply Voltage Output Current P Input Voltage Clamp Diode Reverse Voltage Clamp Diode Forward Current Power Dissipation P F VCC IOUT VIN VR IF PD DC 1 Circuit Tpw = 25 ms, Duty = 50%, 4 Circuits Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%) MIN TYP. MAX UNIT 3―6 V 0 ― 180 mA 0 ― 150 (Note) ― ― ― ― ― ― VCC V ― VCC V ― 180 mA ― 0.44 W ― 0.325 2 2001-06-28 ELECTRICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC Output Leakage Current Output Saturation Voltage DC Current Transfer Ratio Input Output Current On TD62301P / F TD62302P / F Input Output Voltage On TD62301P / F TD62302P / F Clamp Diode Forward Voltage SYMBOL ICEX VCE (sat) hFE IIN (ON) TEST CIR− CUIT TEST CONDITION VCC = 6 V, VOUT = 6 V, Ta = 50°C 1 VCC = 6 V, VOUT = 6 V, Ta = 25°C VCC = 5 V, IIN = 0.14 mA 2 IOUT = 70 mA VCC = 5 V, IIN = 0.3 mA IOUT = 150 mA 2 VCC = 5 V, VOUT = 2 V IOUT = 120 mA 3 VCC = 5 V, VIN = 2.4 V IOUT = 120 mA VIN (ON) VF 4 VCC = 5 V, IIN = 0.2 mA IOUT = 120 mA 5 IF = 120 mA Supply Current ICC 6 IF = 120 mA Input Capacitance Turn−On Delay Turn−Off Delay CIN tON tOFF ― VIN = 0, f = 1 MHz 7 VCC = 6 V, RL=33 Ω CL = 15 pF TD62301,302P/F MIN TYP. MAX UNIT ―― 7 µA ―― 1 ― ― 0.5 V ― ― 0.7 1000 2000 ― ― ― 0.60 mA ― ― 0.14 ― ― 2.3 V ― ― 4.0 ― ― 2.0 V ― 15 22 mA / Gate ― 15 ― pF ― 0.1 ― µs ― 0.2 ― µs 3 2001-06-28 TEST CIRCUIT 1. ICEX 2. hFE, VCE (sat) TD62301,302P/F 3. IIN (ON) 4. VIN (ON) 7. tON, tOFF 5. VF 6. ICC Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns Note 2: CL includes probe and jig capacitance. PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 4 2001-06-28 TD62301,302P/F 5 2001-06-28 PACKAGE DIMENSIONS DIP16−P−300−2.54A TD62301,302P/F Unit : mm Weight: 1.11 g (Typ.) 6 2001-06-28 PACKAGE DIMENSIONS SOP16−P−225−1.27 TD62301,302P/F Unit : mm Weight: 0.16 g (Typ.) 7 2001-06-28 TD62301,302P/F RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applicati.


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