( DataSheet : www.DataSheet4U.com )
PROCESS
Small Signal Transistor
CP225
Central
TM
NPN - Amp/Switch Transistor C...
( DataSheet : www.DataSheet4U.com )
PROCESS
Small Signal
Transistor
CP225
Central
TM
NPN - Amp/Switch
Transistor Chip
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 28,960 PRINCIPAL DEVICE TYPES 2N2218A 2N2221A EPITAXIAL PLANAR 19.8 x 19.8 MILS 9.5 MILS 4.3 x 4.3 MILS 4.3 x 4.3 MILS Al - 30,000Å Au - 12,000Å
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R1 (1-August 2002)
www.DataSheet4U.com
Central
TM
PROCESS
CP225
Semiconductor Corp.
Typical Electrical Characteristics
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R1 (1-August 2002)
...