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CE1A3Q Dataheets PDF



Part Number CE1A3Q
Manufacturers NEC
Logo NEC
Description COMPOUND TRANSISTOR
Datasheet CE1A3Q DatasheetCE1A3Q Datasheet (PDF)

DATA SHEET COMPOUND TRANSISTOR CE1A3Q on-chip resistor NPN silicon epitaxial transistor For mid-speed switching The CE1A3Q is a transistor of on-chip high hFE resistor incorporating dumper diode in collector to emitter and zener diode in collector to base as protect elements. This transistor is ideal for actuator drives of OA equipments and electric equipments. PACKAGE DRAWING (UNIT: mm) FEATURES • On-chip zener diode for surge voltage absorption • On-chip bias resistor: R1 = 1.0 kΩ, R2 = 10.

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DATA SHEET COMPOUND TRANSISTOR CE1A3Q on-chip resistor NPN silicon epitaxial transistor For mid-speed switching The CE1A3Q is a transistor of on-chip high hFE resistor incorporating dumper diode in collector to emitter and zener diode in collector to base as protect elements. This transistor is ideal for actuator drives of OA equipments and electric equipments. PACKAGE DRAWING (UNIT: mm) FEATURES • On-chip zener diode for surge voltage absorption • On-chip bias resistor: R1 = 1.0 kΩ, R2 = 10 kΩ • Low power consumption during driving: VOL = 0.12 V @VI = 5.0 V, IC = 0.5 A • On-chip dumper diode for reverse cable ABSOLUTE MAXIMUM RATINGS (Ta = 25°C) Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector current (DC) Collector current (Pulse) Base current (DC) Total power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC(DC) IC(pulse) * IB(DC) PT Tj Tstg Ratings 60±10 60±10 15 ±2.0 ±3.0 0.03 1.0 150 −55 to +150 Unit V V V A A A W °C °C * PW ≤ 10 ms, duty cycle ≤ 50 % ELECTRICAL CHARACTERISTICS (Ta = 25°C) Parameter Colletor to emitter voltage Collector cutoff current DC current gain DC current gain DC current gain Low level output voltage Low level input voltage Input resistance 1 Input resistance 2 Turn-on time Storage time Fall time Symbol VCEO(SUS) ICBO hFE1 ** hFE2 ** hFE3 ** VOL ** VIL ** R1 R2 ton tstg tf IC = 1.0 A IBI = −IB2 = 10 mA VCC = 20 V, RL = 20 Ω Conditions IC = 2.0 A, IB = 5.0 Ma, L = 6.0 mH VCB = 40 V, IE = 0 VCE = 5.0 V, IC = 0.2 A VCE = 5.0 V, IC = 1.0 A VCE = 5.0 V, IC = 2.0 A VI = 5.0 V, IC = 0.5 A VCE = 12 V, IC = 100 µA 0.7 7.0 700 1000 500 1200 1700 1300 0.12 0.46 1.0 10.0 0.4 1.4 0.5 0.3 0.4 1.3 13.0 3000 MIN. 50 TYP. 60 100 MAX. Unit V nA − − − V V kΩ kΩ µs µs µs ** Pulse test PW≤350 µs, duty cycle≤2 % The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. D16177EJ1V0DS00 Date Published April 2002 N CP(K) Printed in Japan © 2002 1998 CE1A3Q TYPICAL CHARACTERISTICS (Ta = 25°C) 2 Data Sheet D16177EJ1V0DS CE1A3Q Data Sheet D16177EJ1V0DS 3 CE1A3Q • The information in this document is current as of July, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic app.


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