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H8S2317 Dataheets PDF



Part Number H8S2317
Manufacturers Hitachi
Logo Hitachi
Description (H8S23xx) 16-Bit Single-Chip Microcomputer
Datasheet H8S2317 DatasheetH8S2317 Datasheet (PDF)

Hitachi 16-Bit Single-Chip Microcomputer H8S/2319, H8S/2318 Series, H8S/2319 F-ZTAT™, H8S/2318 F-ZTAT™, H8S/2315 F-ZTAT™ H8S/2319 H8S/2318 H8S/2317 H8S/2316 H8S/2315 H8S/2313 H8S/2312 H8S/2311 H8S/2310 HD64F2319 HD6432318, HD64F2318 HD6432317 HD6432316 HD64F2315 HD6432313 HD6412312 HD6432311 HD6412310 Reference Manual — Individual Product Specifications — ADE-602-188A Rev. 2.0 8/24/00 Hitachi, Ltd. www.DataSheet4U.com www.DataSheet4U.com Cautions 1. Hitachi neither warrants nor grants licen.

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Document
Hitachi 16-Bit Single-Chip Microcomputer H8S/2319, H8S/2318 Series, H8S/2319 F-ZTAT™, H8S/2318 F-ZTAT™, H8S/2315 F-ZTAT™ H8S/2319 H8S/2318 H8S/2317 H8S/2316 H8S/2315 H8S/2313 H8S/2312 H8S/2311 H8S/2310 HD64F2319 HD6432318, HD64F2318 HD6432317 HD6432316 HD64F2315 HD6432313 HD6412312 HD6432311 HD6412310 Reference Manual — Individual Product Specifications — ADE-602-188A Rev. 2.0 8/24/00 Hitachi, Ltd. www.DataSheet4U.com www.DataSheet4U.com Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Main Revisions and Additions in this Edition Page All Item Whole sections Revisions (See Manual for Details) Amendment due to the addition of the H8S/2319 F-ZTAT, H8S/2315 F-ZTAT, H8S/2316, and H8S/2313 to the product lineup. Table 1.1 Overview The product lineup added. Figure 1.1 Block Diagram Note 1 amended due to the addition of WDTOVF (FWE, EMLE). Figure 1.2 Pin Arrangement Note amended due to the addition of WDTOVF (FWE, EMLE). Figure 1.3 Pin Arrangement Note amended due to the addition of WDTOVF (FWE, EMLE). 1.4 Pin Functions in Each Operating Mode Table 1.2 Pin Functions in Each Operating Mode Functions for pins 32 to 39, 41 to 48, and 50 to 52 (TFP-100B) in flash memory programmer mode amended. Function for pin 60 (TFP-100B) amended Note 3 amended. 1.5 Pin Functions Table 1.3 Pin Functions EMLE pin added. Note 4 added. 1.6 Product Lineup 2.5 Memory Map in Each Operating Mode Note 2 added. Figure 2.1 H8S/2319 F-ZTAT Memory Map in Each Operating Mode added. Figures 2.2, 2.3, and 2.7 Memory Map in Each Operating Mode Note on reserved area added. Figure 2.4 H8S/2316 Memory Map in Each Operating Mode added. Figure 2.5 H8S/2315 F-ZTAT Memory Map in Each Operating Mode added. Figure 2.6 H8S/2313 Memory Map in Each Operating Mode added. 2.6 H8S/2318 Series Operating Modes (F-ZTAT Version) Deleted (see the hardware manual). 5 6 1.1 Overview 1.2 Block Diagram 7 1.3 Pin Arrangement 8 10 12 15 19 20 32 33 to 36, 42 37 38 to 40 41 — Page 51 Item 3.3.3 Interrupt Exception Vector Table Revisions (See Manual for Details) Table 3.3 Interrupt Sources, Vector Addresses, and Interrupt Priorities Names for SCI interrupts RXI0 and RXI1 amended. Table 3.8 Interrupt Response Times Number of wait states until execution instruction ends amended. Description of bit 5 H8S/2319, H8S/2316, H8S/2315, and H8S/2313 added Table 5.23 I/O Port States in Each Processing State LWROD and DAOEn added to Legend. Figure 5.35(a) Port G Block Diagram (Pin PG0) Amended. Amended due to the addition of the H8S/2319 FZTAT to the product lineup. Table 7.8 A/D Conversion Characteristics Nonlinearity error, offset error, full-scale error, quantization error, and absolute accuracy amended. Added. 54 3.5 Interrupt Response Times 73 4.2.5 Bus Control Register L (BCRL) 5.13 Pin States 177 200 225 252 5.14.11 Port G 6.11 ROM 7.1.4 A/D Conversion Characteristics 254 to 262 7.2 Electrical Characteristics of Mask ROM Version (H8S/2318, H8S/2317) in Low-Voltage Operation 7.3 El.


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