HEXFET Power MOSFET
m o .c U 4 t e e h S a at Applications Frequency Synchronous Buck .D High Converters for Computer Processor Power w w Hi...
Description
m o .c U 4 t e e h S a at Applications Frequency Synchronous Buck .D High Converters for Computer Processor Power w w High Frequency Isolated DC-DC w Converters with Synchronous Rectification
l l l
PD - 95443A
IRFR3707ZPbF IRFU3707ZPbF
HEXFET® Power MOSFET
for Telecom and Industrial Use Lead-Free
Benefits l Very Low RDS(on) at 4.5V VGS l Ultra-Low Gate Impedance l Fully Characterized Avalanche Voltage and Current
Absolute Maximum Ratings
VDS VGS
ID @ TC = 25°C IDM
ID @ TC = 100°C PD @TC = 25°C
PD @TC = 100°C TJ TSTG
Thermal Resistance
RθJC RθJA RθJA
m o .c U 4 t e e h S a t a .D w w w
30V 9.5m:
D-Pak IRFR3707Z
Parameter Max.
30 ± 20 Drain-to-Source Voltage Gate-to-Source Voltage V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current 56 39
VDSS RDS(on) max
Qg
9.6nC
I-Pak IRFU3707Z
Units
f f
A
220 50 25
Maximum Power Dissipation Maximum Power Dissipation Linear Derating Factor Operating Junction and
W
0.33
-55 to + 175
W/°C °C
Storage Temperature Range
Soldering Temperature, for 10 seconds
300 (1.6mm from case)
Parameter
Typ.
––– ––– –––
Junction-to-Case Junction-to-Ambient (PCB Mount) Junction-to-Ambient
gÃ
Notes through
are on page 11
www.irf.com
m o .c U 4 t e e h S a 1 at .D w w w
Max.
3.0 50
Units
°C/W
110
12/6/04
IRFR/U3707ZPbF
Static @ TJ = 25°C (unless otherwise specified)
Parameter
BVDSS ∆ΒVDSS/∆TJ RDS(on) VGS(th) ∆VGS(th)/∆TJ IDSS IGSS gfs Qg Qgs1 Qgs2 Qgd Qgodr Qsw Qoss td(on) tr td(o...
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