WS512K32V

WS512K32V-XXX HI-RELIABILITY PRODUCT 512Kx32 SRAM 3.3V MODULE FEATURES s Access Times of 15, 17, 20ns s Low Voltage Operation s Packaging 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high, (Package 509) PRELIMINARY* s Low Power CMOS s TTL Compatible Inputs and Outputs s Fully Static Operation: No clock or refresh required. s Three State Output. s Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation s Weight WS512K32V-XG2TX - 8 grams typical WS512K32V-XG1UX - 5 grams typical WS512K32NV-XH1X - 13 grams typical * This data sheet describes a product under development, not fully characterized, and is subject to change without notice. 68 lead, 23.9mm (0.940" sq.) Low Profile CQFP (G1U), 3.56mm (0.140") high, (Package 519) s Organized as 512Kx32; User Configurable as 1Mx16 or 2Mx8 s Commercial, Industrial and Military Temperature Ranges s Low Voltage Operation: 3.3V ± 10% Power Supply PIN CONFIGURATION FOR WS512K32NV-XH1X TOP VIEW 1 I/O8 I/O9 I/O10 A13 A14 A15 A16 A17 I/O0 I/O1 I/O2 11 22 12 WE2 CS2 GND I/O11 A10 A11 A12 VCC CS1 NC I/O3 33 23 I/O15 I/O14 I/O13 I/O12 OE A18 WE1 I/O7 I/O6 I/O5 I/O4 I/O24 I/O25 I/O26 A6 A7 NC A8 A9 I/O16 I/O17 I/O18 44 34 VCC CS4 WE4 I/O27 A3 A4 A5 WE3 CS3 GND I/O19 55 45 I/O31 I/O30 56 PIN DESCRIPTION I/O0-31 A0-18 WE1-4 CS1-4 I/O29 I/O28 A0 A1 A2 WE1 CS 1 Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply ...