PROCESS
Small Signal Transistor
PNP - Amp/Switch Transistor Chip
CP592
Central
TM
Semiconductor Corp.
PROCESS DETA...
PROCESS
Small Signal
Transistor
PNP - Amp/Switch
Transistor Chip
CP592
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 47,150 PRINCIPAL DEVICE TYPES 2N3906 CMPT3906 CMST3906 CXT3906 CZT3906 EPITAXIAL PLANAR 12 x 20 MILS 9.0 MILS 3.6 X 3.6 MILS 3.6 X 3.6 MILS Al - 30,000Å Au - 18,000Å
BACKSIDE COLLECTOR
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145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R2 (1-August 2002)
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www.DataSheet4U.com
Central
TM
PROCESS
CP592
Semiconductor Corp.
Typical Electrical Characteristics
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R2 (1-August 2002)
...