1 Megabit High Speed CMOS SRAM
The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM
devices are a revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC).
Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages,
or mounted on a 50-pin PGA co-fired ceramic substrate. These devices
pack 1-Megabits of low-power CMOS static RAM in an area as small
as 0.463 in2, while maintaining a total height as low as 0.082 inches.
The SLCC devices contain an individual 128K x 8 SRAMs, each
packaged in a hermetically sealed SLCC, making the modules suitable
for commercial, industrial and military applications.
The DPS128M8BnY/DPS128X8BA3 has one active low Chip Enable
(CE) while the DPS128M8CnY/DPS128X8CA3 has an active low Chip
Enable (CE) and an active high Select Line (SEL).
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board
density of memory than available with conventional through-hole,
surface mount or hybrid techniques.
• Organization Available: 128Kx8
• Access Times: 20*, 25, 30, 35, 45ns
• Fully Static Operation - No clock or refresh required
• Single +5V Power Supply, ±10% Tolerance
• TTL Compatible
• Common Data Inputs and Outputs
• Low Data Retention Voltage: 2.0V min.
• Packages Available:
48 - Pin SLCC
48 - Pin Straight Leaded SLCC
48 - Pin ‘’J’’ Leaded SLCC
48 - Pin Gullwing Leaded SLCC
50 - Pin PGA Dense-Stack
w * Commercial only.
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.