DatasheetsPDF.com

DPS128C32BV3

Part Number	DPS128C32BV3
Manufacturer	Dense-Pac Microsystems
Description	512kx8 High Speed CMOS SRAM
Published	Dec 14, 2005
Detailed Description	4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new...
Datasheet	DPS128C32BV3 PDF File

Overview

4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate.
It offers 4 Megabits of SRAM in a package envelope of 1.
090 x 1.
090 x 0.
300 inches.
The DPS128C32BV3 contains four individual 128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs making the module suitable for commercial, industrial and military applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board density of memory than available with conventional through-hole, surface mount, modul...

Similar Datasheet

DPS128C32BV3 512kx8 High Speed CMOS SRAM - Dense-Pac Microsystems

Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)