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CPD15

500mA Glass Passivated Rectifier

Description

PROCESS Ultra Fast Rectifier CPD15 Central TM 500mA Glass Passivated Rectifier Chip Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 25 x 25 MILS 9.5 MILS 14.5 x 14.5 MILS Au - 5,000Å Au - 2,000Å GEOMETRY GROSS DIE PER 4 INCH WAFER 18,080 PRINC...

Central Semiconductor

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