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IR2161PbF Dataheets PDF



Part Number IR2161PbF
Manufacturers International Rectifier
Logo International Rectifier
Description HALOGEN CONVERTOR CONTROL IC
Datasheet IR2161PbF DatasheetIR2161PbF Datasheet (PDF)

Data Sheet No. PD60219 rev C IR2161(S) & (PbF) HALOGEN CONVERTOR CONTROL IC Features • Intelligent half-bridge driver • Auto Resetting Short Circuit Protection • Auto Resetting Overload Protection • Externally Triggerable Latching Shutdown • Latching Overtemperature Protection • Frequency Modulation “dither” (for lower EMI) • Micropower Startup (<300 μA) • Phase Cut dimmable for leading / trailing edge • Output Voltage Shift Compensation. • Real Softstart • Adaptive Dead Time • Small 8 Pin DIP.

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Data Sheet No. PD60219 rev C IR2161(S) & (PbF) HALOGEN CONVERTOR CONTROL IC Features • Intelligent half-bridge driver • Auto Resetting Short Circuit Protection • Auto Resetting Overload Protection • Externally Triggerable Latching Shutdown • Latching Overtemperature Protection • Frequency Modulation “dither” (for lower EMI) • Micropower Startup (<300 μA) • Phase Cut dimmable for leading / trailing edge • Output Voltage Shift Compensation. • Real Softstart • Adaptive Dead Time • Small 8 Pin DIP/SOIC Package • Also available LEAD-FREE (PbF) Description Packages 8-Lead PDIP IR2161 8-Lead SOIC IR2161S The IR2161 is a dedicated Intelligent Half bridge Driver IC for a Halogen convertor (electronic transformer). It includes all necessary protection features and also allows the Convertor to be dimmed externally with a standard phase cut dimmer with both leading or trailing edge types. This IC provides the advantage of reduced thermal stress in the lamp due to softstart. There is also compensation of the output voltage for load regulation. It enables the convertor to operate with extremely low harmonic distortion over the full range of loads. The IR2161 includes adaptive deadtime to allow cool running MOSFETs and improves the EMI behaviour due to frequency modulation (dither). All the features are integrated in a small 8 pin DIP/SOIC package to allow for a size reduction in the next generation of convertors. Typical Connections D1 LF AC LINE INPUT CLF RD CD D2 RS DCP1 DS CVCC1 DCP2 DB VCC 1 8 VB Q1 CSNUB COM CVCC2 CSD 2 3 7 HO 6 VS CB T1 R1 IR2161 VZ CS 4 5 LO Q2 C3 C4 C1 D3 D4 CSD CCS RL RCS 12VAC OUTPUT R2 C2 Note: Throughout this data sheet “convertor” is spelled in accordance with standard IEC 61047 “DC or AC supplied convertors for filament lamps – Performance requirements”. www.irf.com 1 IR2161(S) & (PbF) Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. VB VS VHO VLO IOMAX High side floating supply voltage High side floating supply offset voltage High side floating output voltage Low side output voltage Maximum allowable output current (HO,LO) due to external power transistor miller effect -0.3 VB - 25 VS - 0.3 -0.3 -500 VCSDMAX VCS ICS ICC dV/dt CSD pin voltage Current sense pin voltage Current sense pin current Supply current (Note 1) Allowable offset voltage slew rate -0.3 -0.3 -5 -20 -50 PD RthJA Maximum power dissipation @ TA ≤ +25°C PD = (TJMAX-TA)/RthJA Thermal resistance, junction to ambient (8 Lead DIP) (8 Lead SOIC) (8 Lead DIP) (8 Lead SOIC) — — — — TJ Junction temperature TS Storage temperature TL Lead temperature (soldering, 10 seconds) -55 -55 — Recommended Operating Conditions For proper operation the device should be used within the recommended conditions. Max. 625 VB + 0.3 VB + 0.3 VCC + 0.3 500 VCC + 0.3 VCC + 0.3 5 20 50 1 0.625 125 200 150 150 300 Units V mA V mA V/ns W °C/W °C Symbol Definition Min. Max. Units VBS High side floating supply voltage VCC - 0.7 VCLAMP VBSMIN Minimum required VBS voltage for proper HO functionality 4.3 — VS Steady state high-side floating supply offset voltage -1 600 V VCC Supply voltage VCCUV+ VCLAMP ICC Supply current (Note 2) 10 mA CSD CSD pin external capacitor 47 — nF ICS Current sense pin current -1 1 mA TJ Junction temperature -25 125 °C Note 1: Note 2: This IC contains a zener clamp structure between the chip VCC and COM which has a nominal breakdown voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than the VCLAMP specified in the Electrical Characteristics section. Enough current should be supplied into the VCC pin to keep the internal 15.6V zener clamp diode on this pin regulating its voltage, VCLAMP. 2 www.irf.com IR2161(S) & (PbF) Electrical Characteristics VCC = VBS = VBIAS = 14V, +/- 0.25V, VCSD = 5.0V, CLO =CHO = 1000 pF, and TA = 25°C unless otherwise specified. Supply Characteristics Symbol Definition VCCUV+ VCCUVVCCUVL- VCC supply undervoltage positive going threshold VCC supply undervoltage negative going threshold VCC supply softstart reset negative going threshold IQCCUV UVLO mode quiescent current ICCFLT Fault-mode quiescent current ICCLF VCC current (low frequency) ICCHF VCC current (high frequency) VCLAMP VCC zener clamp voltage Floating Supply Characteristics Min. Typ. Max. Units Test Conditions 11.5 12.1 12.7 10 10.5 11 — — 5.5 — 250 300 — 1.4 2.0 — 2.0 3.0 — 4.0 7.0 14.5 15.4 16.5 VCC rising from 0V V VCC falling from 14V VCC - VCCUV- (-2V) μA VCC = 11V CS=8V, VCSD=0V mA VCC=14V,VCSD=5.2V VCC=14V,VCSD=0V V ICC = 5mA Symbol Definition Min. Typ. Max.


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