MPX2300D

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub–module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Motorola’s unique sensor die with its patented, piezoresistive implant technology, along with the added feature of on–chip, thin–film temperature compensation and calibration. Features: Low Cost Patented piezoresistive strain gauge implant, temperature compensation and calibration all integrated on a single, monolithic sensor die. Pressure Range Available: 0–300 mmHg Polysulfone (Mindell S–1000) Case Material (Medical, Class VI Approved) Order this document by MPX2300D/D MPX2300D PRESSURE SENSORS CHIP PAK ELEMENT CASE 423–03 Style 1 Motorola is offering the Chip Pak option package. Application–specific parts will have an “SPX” prefix, followed by a four digit number, unique to the specific customer. Devices will be shipped in a tape and reel packaging. NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer’s housing. Use caution when handling the devices during all processes. Pin Number, Style 1 1 ...