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32N50Q

Part Number	32N50Q
Manufacturer	IXYS Corporation
Description	IXFR32N50Q
Features	• Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical i...
Published	Oct 1, 2005
Datasheet	32N50Q PDF File

Features

• Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation
• Low drain to tab capacitance(<50pF)
• Low RDS (on) HDMOSTM process
• Rugged polysilicon gate cell structure
• Unclamped...

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