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HCPL-7710 Dataheets PDF



Part Number HCPL-7710
Manufacturers Hewlett-Packard
Logo Hewlett-Packard
Description 40 ns Propagation Delay / CMOS Optocoupler
Datasheet HCPL-7710 DatasheetHCPL-7710 Datasheet (PDF)

Agilent HCPL-7710, HCPL-0710 40 ns Propagation Delay, CMOS Optocoupler Data Sheet Description Available in either an 8-pin DIP or SO-8 package style respectively, the HCPL-7710 or HCPL-0710 optocouplers utilize the latest CMOS IC technology to achieve outstanding performance with very low power consumption. The HCPL-x710 require only two bypass capacitors for complete CMOS compatibility. Basic building blocks of the HCPL-x710 are a CMOS LED driver IC, a high speed LED and a CMOS detector IC. A.

  HCPL-7710   HCPL-7710



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Agilent HCPL-7710, HCPL-0710 40 ns Propagation Delay, CMOS Optocoupler Data Sheet Description Available in either an 8-pin DIP or SO-8 package style respectively, the HCPL-7710 or HCPL-0710 optocouplers utilize the latest CMOS IC technology to achieve outstanding performance with very low power consumption. The HCPL-x710 require only two bypass capacitors for complete CMOS compatibility. Basic building blocks of the HCPL-x710 are a CMOS LED driver IC, a high speed LED and a CMOS detector IC. A CMOS logic input signal controls the LED driver IC which supplies current to the LED. The detector IC incorporates an integrated photodiode, a high-speed transimpedance amplifier, and a voltage comparator with an output driver. Functional Diagram TRUTH TABLE (POSITIVE LOGIC) VI, INPUT VI 2 IO * 3 LED1 GND1 4 SHIELD 5 GND2 6 VO 7 NC* H L LED1 OFF ON VO, OUTPUT H L Features • +5 V CMOS compatibility • 8 ns maximum pulse width distortion • 20 ns maximum prop. delay skew • High speed: 12 Mbd • 40 ns maximum prop. delay • 10 kV/µs minimum common mode rejection • -40°C to 100°C temperature range • Safety and regulatory approvals UL Recognized 3750 V rms for 1 min. per UL 1577 CSA Component Acceptance Notice #5 IEC/EN/DIN EN 60747-5-2 – VIORM = 630 Vpeak for HCPL-7710 Option 060 – VIORM = 560 Vpeak for HCPL-0710 Option 060 Applications • Digital fieldbus isolation: DeviceNet, SDS, Profibus • AC plasma display panel level shifting • Multiplexed data transmission • Computer peripheral interface • Microprocessor system interface **VDD1 1 8 VDD2** * Pin 3 is the anode of the internal LED and must be left unconnected for guaranteed data sheet performance. Pin 7 is not connected internally. ** A 0.1 µF bypass capacitor must be connected between pins 1 and 4, and 5 and 8. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Selection Guide 8-Pin DIP (300 Mil) HCPL-7710 Small Outline SO-8 HCPL-0710 Ordering Information Specify Part Number followed by Option Number (if desired) Example HCPL-7710#XXXX 060 = IEC/EN/DIN EN 60747-5-2 Option. 300 = Gull Wing Surface Mount Option (HCPL-7710 only). 500 = Tape and Reel Packaging Option. XXXE = Lead Free Option No Option and Option 300 contain 50 units (HCPL-7710), 100 units (HCPL-0710) per tube. Option 500 contain 1000 units (HCPL-7710), 1500 units (HCPL-0710) per reel. Option data sheets available. Contact Agilent sales representative or authorized distributor. Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001 and lead free option will use “–” Package Outline Drawing HCPL-7710 8-Pin DIP Package 9.65 ± 0.25 (0.380 ± 0.010) TYPE NUMBER 8 7 6 5 OPTION 060 CODE* 7.62 ± 0.25 (0.300 ± 0.010) 6.35 ± 0.25 (0.250 ± 0.010) DATE CODE A XXXXV YYWW 1 1.19 (0.047) MAX. 2 3 4 1.78 (0.070) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 5° TYP. 3.56 ± 0.13 (0.140 ± 0.005) 4.70 (0.185) MAX. 0.51 (0.020) MIN. 2.92 (0.115) MIN. DIMENSIONS IN MILLIMETERS AND (INCHES). *OPTION 300 AND 500 NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 1.080 ± 0.320 (0.043 ± 0.013) 0.65 (0.025) MAX. 2.54 ± 0.25 (0.100 ± 0.010) 2 Package Outline Drawing HCPL-7710 Package with Gull Wing Surface Mount Option 300 LAND PATTERN RECOMMENDATION 9.65 ± 0.25 (0.380 ± 0.010) 8 7 6 5 1.016 (0.040) 6.350 ± 0.25 (0.250 ± 0.010) 10.9 (0.430) 1 2 3 4 1.27 (0.050) 2.0 (0.080) 1.19 (0.047) MAX. 1.780 (0.070) MAX. 9.65 ± 0.25 (0.380 ± 0.010) 7.62 ± 0.25 (0.300 ± 0.010) + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 3.56 ± 0.13 (0.140 ± 0.005) 1.080 ± 0.320 (0.043 ± 0.013) 0.635 ± 0.130 2.54 (0.025 ± 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 0.635 ± 0.25 (0.025 ± 0.010) 12° NOM. NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. Package Outline Drawing HCPL-0710 Outline Drawing (Small Outline SO-8 Package) LAND PATTERN RECOMMENDATION 8 7 6 5 3.937 ± 0.127 (0.155 ± 0.005) XXXV YWW 5.994 ± 0.203 (0.236 ± 0.008) TYPE NUMBER (LAST 3 DIGITS) DATE CODE 4 7.49 (0.295) PIN ONE 1 0.406 ± 0.076 (0.016 ± 0.003) 2 3 1.9 (0.075) 1.270 BSC (0.050) 0.64 (0.025) * 5.080 ± 0.127 (0.200 ± 0.005) 7° 45° X 0.432 (0.017) 3.175 ± 0.127 (0.125 ± 0.005) 0 ~ 7° 1.524 (0.060) 0.203 ± 0.102 (0.008 ± 0.004) 0.228 ± 0.025 (0.009 ± 0.001) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.207 ± 0.254 (0.205 ± 0.010) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. OPTION NUMBER 500 NOT MARKED. 0.305 MIN. (0.012) NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX. 3 Solder Reflow Thermal Profile 300 PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK TEMP. 245°C PEAK TEMP. 240°C PEAK TEMP. 230°C 2.5°C ± 0.5°C/SEC. 160°C 150°C 140°C 3°C + 1°C/–0.5°C 30 SEC. 30 SEC. SOLDERING TIME 200°C .


FMM1103VJ HCPL-7710 HM5116100


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