PDF: 2003 Apr 07
Philips Semiconductors
Package outline
HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad
SOT527-1
D
E
A
X
c y exposed die pad side HE v M A
Z
Dh
20
11
pin 1 index
Eh
A2 A1
(A 3)
A θ
Lp L
1
e bp
10
w M detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the ori...
