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SFH6326 Dataheets PDF



Part Number SFH6326
Manufacturers Vishay Siliconix
Logo Vishay Siliconix
Description High Speed Optocoupler
Datasheet SFH6326 DatasheetSFH6326 Datasheet (PDF)

www.vishay.com SFH6325, SFH6326 Vishay Semiconductors High Speed Optocoupler, Dual Channel, 1 MBd, Transistor Output i179026 A1 1 C1 2 C2 3 A2 4 i179071-3 8 C(VCC) 7 C1(VO1) 6 C2(VO2) 5 E(GND) DVE DESCRIPTION The SFH6325 and SFH6326 are dual channel optocouplers with a GaAIAs infrared emitting diode, optically coupled with an integrated photo detector which consists of a photo diode and a high-speed transistor in a DIP-8 plastic package. Signals can be transmitted between two electrically .

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www.vishay.com SFH6325, SFH6326 Vishay Semiconductors High Speed Optocoupler, Dual Channel, 1 MBd, Transistor Output i179026 A1 1 C1 2 C2 3 A2 4 i179071-3 8 C(VCC) 7 C1(VO1) 6 C2(VO2) 5 E(GND) DVE DESCRIPTION The SFH6325 and SFH6326 are dual channel optocouplers with a GaAIAs infrared emitting diode, optically coupled with an integrated photo detector which consists of a photo diode and a high-speed transistor in a DIP-8 plastic package. Signals can be transmitted between two electrically separated circuits up to frequencies of 2 MHz. The potential difference between the circuits to be coupled should not exceed the maximum permissible reference voltages. FEATURES • Isolation test voltage, 5300 VRMS • TTL compatible • Bit rates: 1 MBit/s • High common mode transient immunity • Bandwidth 2 MHz • Open collector output • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 AGENCY APPROVALS • UL1577 (pending) • DIN EN 60747-5-5 (VDE 0884-5), available with option 1 (pending) • cUL (pending) • CQC (pending) ORDERING INFORMATION DIP-8 Option 6 SFH6 3 2 # - X0 # #T PART NUMBER PACKAGE OPTION TAPE AND REEL 7.62 mm Option 7 10.16 mm Option 9 AGENCY CERTIFIED/PACKAGE UL, cUL, CQC ≥7 DIP-8 - DIP-8, 400 mil, option 6 - SMD-8, option 7 - SMD-8, option 9 SFH6325-X009T VDE, UL, cUL, CQC ≥7 DIP-8 - SMD-8, option 7 SFH6325-X017T Notes • Additional options may be possible, please contact sales office. (1) Also available in tubes; do not add T to end. CTR (%) > 0.7 mm > 0.1 mm ≥ 19 SFH6326 SFH6326-X006 SFH6326-X007T (1) SFH6326-X009T (1) ≥ 19 SFH6326-X001 SFH6326-X017T (1) ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL INPUT Reverse voltage Forward continuous current Peak forward current Maximum surge forward current t = 1 ms, duty cycle 50 % t ≤ 1 μs, 300 pulses/s VR IF IFM IFSM Derate linearly from 25 °C Power dissipation Tamb ≤ 70 °C Pdiss VALUE 4.5 25 50 1 0.6 50 UNIT V mA mA A mW/°C mW Rev. 1.8, 26-Jul-2019 1 Document Number: 83679 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 www.vishay.com SFH6325, SFH6326 Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT OUTPUT Supply voltage Output voltage Collector output current Derate linearly from 25 °C VS -0.5 to 30 V VO -0.5 to 25 V ICO 8 mA 1.33 mW/°C Power dissipation COUPLER Tamb ≤ 70 °C Pdiss 50 mW Isolation test voltage Pollution degree (DIN VDE0109) t = 1 min VISO 5300 2 VRMS Creepage distance ≥ 8 mm Clearance distance ≥ 8 mm Derate linearly from 25 °C 1.93 mW/°C Total package dissipation Comparative tracking index per DIN IEC112/VDE0303 part 1, group IIIa per DIN VDE6110 Ptot 145 mW 175 Isolation resistance Storage temperature range Ambient temperature range Soldering temperature (1) VIO = 500 V, Tamb = 25 °C VIO = 500 V, Tamb = 100 °C max. 10 s, dip soldering distance to seating plane ≥ 1.5 mm RIO RIO Tstg Tamb Tsld ≥ 1012 ≥ 1011 -55 to +150 -55 to +100 260 Ω Ω °C °C °C Notes • Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability (1) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through hole devices (DIP) ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITION PART SYMBOL MIN. TYP. MAX. UNIT INPUT Forward voltage Breakdown voltage Reverse current Capacitance Temperature coefficient of forward voltage OUTPUT IF = 16 mA IR = 10 μA VR = 4.5 V VR = 0 V, f = 1 MHz IF = 16 mA VF VBR IR CO ΔVF/ΔTamb 4.5 1.33 0.5 30 -1.7 1.9 V V 10 μA pF mV/°C Logic low supply current Supply current, logic high Logic low output voltage Logic high output current Channel to channel (1) crosstalk COUPLER IF = 16 mA, VO = open, VCC = 4.5 V IF = 0 mA, VO = open, VCC = 15 V IF = 16 mA, VCC = 4.5 V, IO = 1.1 mA IF = 16 mA, VCC = 4.5 V, IO = 3 mA IF = 0 mA, VO = VCC = 5.5 V IF = 0 mA, VO = VCC = 15 V IF = 16 mA, VO = VCC = 5.5 V SFH6325 SFH6326 ICCL ICCH VOL VOL IOH IOH IOH-XT 100 0.01 0.1 0.1 3 200 4 0.5 0.5 500 50 500 μA μA V V nA μA nA Capacitance (input to output) f = 1 MHz CIO 0.6 pF Notes • Tamb = 0 °C to 70 °C, unless otherwise specified, typical values Tamb = 25 °C • Minimum and maximum values are testing requirements. Typical values are characteristics of the devic.


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