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M2S56D20ATP-10 Dataheets PDF



Part Number M2S56D20ATP-10
Manufacturers Mitsubishi
Logo Mitsubishi
Description 256M Double Data Rate Synchronous DRAM
Datasheet M2S56D20ATP-10 DatasheetM2S56D20ATP-10 Datasheet (PDF)

DDR SDRAM (Rev.1.44) Mar. '02 MITSUBISHI LSIs M2S56D20/ 30/ 40ATP -75AL, -75A, -75L, -75, -10L, -10 M2S56D20/ 30/ 40AKT -75AL, -75A, -75L, -75, -10L, -10 256M Double Data Rate Synchronous DRAM Contents are subject to change without notice. DESCRIPTION M2S56D20ATP / AKT is a 4-bank x 16777216-word x 4-bit, M2S56D30ATP / AKT is a 4-bank x 8388608-word x 8-bit, M2S56D40ATP/ AKT is a 4-bank x 4194304-word x 16-bit, double data rate synchronous DRAM, with SSTL_2 interface. All control and address .

  M2S56D20ATP-10   M2S56D20ATP-10


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DDR SDRAM (Rev.1.44) Mar. '02 MITSUBISHI LSIs M2S56D20/ 30/ 40ATP -75AL, -75A, -75L, -75, -10L, -10 M2S56D20/ 30/ 40AKT -75AL, -75A, -75L, -75, -10L, -10 256M Double Data Rate Synchronous DRAM Contents are subject to change without notice. DESCRIPTION M2S56D20ATP / AKT is a 4-bank x 16777216-word x 4-bit, M2S56D30ATP / AKT is a 4-bank x 8388608-word x 8-bit, M2S56D40ATP/ AKT is a 4-bank x 4194304-word x 16-bit, double data rate synchronous DRAM, with SSTL_2 interface. All control and address signals are referenced to the rising edge of CLK.Input data is registered on both edges of data strobes, and output data and data strobe are referenced on both edges of CLK. The M2S56D20/30/40ATP achieve very high speed data rate up to 133MHz, and are suitable for main memory in computer systems. FEATURES - VDD=VDDQ=2.5V+0.2V - Double data rate architecture; two data transfers per clock cycle - Bidirectional, data strobe (DQS) is transmitted/received with data - Differential clock inputs (CLK and /CLK) - DLL aligns DQ and DQS transitions - Commands are entered on each positive CLK edge - Data and data mask are referenced to both edges of DQS - 4-bank operations are controlled by BA0, BA1 (Bank Address) - /CAS latency- 2.0/2.5 (programmable) - Burst length- 2/4/8 (programmable) - Burst type- sequential / interleave (programmable) - Auto precharge / All bank precharge is controlled by A10 - 8192 refresh cycles /64ms (4 banks concurrent refresh) - Auto refresh and Self refresh - Row address A0-12 / Column address A0-9,11(x4)/ A0-9(x8)/ A0-8(x16) - SSTL_2 Interface - Both 66-pin TSOP Package and 64-pin Small TSOP Package M2S56D*0ATP: 0.8mm lead pitch 66-pin TSOP Package M2S56D*0AKT: 0.4mm lead pitch 64-pin Small TSOP Package - JEDEC standard - Low Power for the Self Refresh Current ICC6 : 2mA (-75AL , -75L , -10L) Operating Frequencies Max. Frequency Max. Frequency @CL=2.0 * @CL=2.5 * M2S56D20/30/40ATP/AKT-75AL/-75A M2S56D20/30/40ATP/AKT-75L/-75 M2S56D20/30/40ATP/AKT-10L/-10 133MHz 100MHz 100MHz 133MHz 133MHz 125MHz Standard DDR266A DDR266B DDR200 * CL = CAS(Read) Latency MITSUBISHI ELECTRIC 1 DDR SDRAM (Rev.1.44) Mar. '02 MITSUBISHI LSIs M2S56D20/ 30/ 40ATP -75AL, -75A, -75L, -75, -10L, -10 M2S56D20/ 30/ 40AKT -75AL, -75A, -75L, -75, -10L, -10 256M Double Data Rate Synchronous DRAM PIN CONFIGURATION(TOP VIEW) x4 x8 x16 VDD NC VDDQ NC DQ0 VSSQ NC NC VDDQ NC DQ1 VSSQ NC NC VDDQ NC NC VDD NC NC /WE /CAS /RAS /CS NC BA0 BA1 A10/AP A0 A1 A2 A3 VDD VDD VDD DQ0 DQ0 VDDQ VDDQ NC DQ1 DQ1 DQ2 VSSQ VSSQ NC DQ3 DQ2 DQ4 VDDQ VDDQ NC DQ5 DQ3 DQ6 VSSQ VSSQ NC DQ7 NC NC VDDQ VDDQ NC LDQS NC NC VDD VDD NC NC NC LDM /WE /WE /CAS /CAS /RAS /RAS /CS /CS NC NC BA0 BA0 BA1 BA1 A10/AP A10/AP A0 A0 A1 A1 A2 A2 A3 A3 VDD VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 NC VSSQ UDQS NC VREF VSS UDM /CLK CLK CKE NC A12 A11 A9 A8 A7 A6 A5 A4 VSS VSS DQ7 VSSQ NC DQ6 VDDQ NC DQ5 VSSQ NC DQ4 VDDQ NC NC VSSQ DQS NC VREF VSS DM /CLK CLK CKE NC A12 A11 A9 A8 A7 A6 A5 A4 VSS VSS NC VSSQ NC DQ3 VDDQ NC NC VSSQ NC DQ2 VDDQ NC NC VSSQ DQS NC VREF VSS DM /CLK CLK CKE NC A12 A11 A9 A8 A7 A6 A5 A4 VSS 66pin TSOP(II) 400mil width x 875mil length 0.65mm Lead Pitch ROW A0-12 Column A0-9,11(x4) A0-9 (x8) A0-8 (x16) CLK,/CLK CKE /CS /RAS /CAS /WE DQ0-15 DQS LDQS,UDQS : Master Clock : Clock Enable : Chip Select : Row Address Strobe : Column Address Strobe : Write Enable : Data I/O : Data Strobe DM LDM,UDM VREF A0-12 BA0,1 VDD VDDQ VSS VSSQ : Write Mask : Reference Voltage : Address Input : Bank Address Input : Power Supply : Power Supply for Output : Ground : Ground for Output MITSUBISHI ELECTRIC 2 DDR SDRAM (Rev.1.44) Mar. '02 MITSUBISHI LSIs M2S56D20/ 30/ 40ATP -75AL, -75A, -75L, -75, -10L, -10 M2S56D20/ 30/ 40AKT -75AL, -75A, -75L, -75, -10L, -10 256M Double Data Rate Synchronous DRAM PIN CONFIGURATION(TOP VIEW) X4 X8 X 16 VDD NC VDDQ NC DQ0 VSSQ NC NC VDDQ NC DQ1 VSSQ NC VDDQ NC NC VDD NC NC /WE /CAS /RAS /CS NC BA0 BA1 A10/AP A0 A1 A2 A3 VDD VDD DQ0 VDDQ NC DQ1 VSSQ NC DQ2 VDDQ NC DQ3 VSSQ NC VDDQ NC NC VDD NC NC /WE /CAS /RAS /CS NC BA0 BA1 A10/AP A0 A1 A2 A3 VDD VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 VDDQ LDQS NC VDD NC LDM /WE /CAS /RAS /CS NC BA0 BA1 A10/AP A0 A1 A2 A3 VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 VSS VSS DQ15 DQ7 VSSQ VSSQ DQ14 NC DQ13 DQ6 VDDQ VDDQ DQ12 NC DQ11 DQ5 VSSQ VSSQ DQ10 NC DQ9 DQ4 VDDQ VDDQ DQ8 NC VSSQ VSSQ UDQS DQS NC NC VREF VREF VSS VSS UDM DM /CLK /CLK CLK CLK CKE CKE NC NC A12 A12 A11 A11 A9 A9 A8 A8 A7 A7 A6 A6 A5 A5 A4 A4 VSS VSS VSS NC VSSQ NC DQ3 VDDQ NC NC VSSQ NC DQ2 VDDQ NC VSSQ DQS NC VREF VSS DM /CLK CLK CKE NC A12 A11 A9 A8 A7 A6.


M2S56D20AKT-75L M2S56D20ATP-10 M2S56D20ATP-10L


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