MA4P1250

Surface Mount PIN Diodes Features q q q q q q q MA4P1250, MA4P1450 SMQ™ V3.00 Non-Rollable MELF Design Hermetically Sealed Low Loss, Low Distortion Passivated PIN Diode Chips Full Face Chip Bonds Non-Magnetic Package Pick and Place Compatibility Size, Inches (mm) Model No. MA4P1250 MA4P1450 Case Style 1072 1091 A(sq.) Min./Max. 0.080/0.095 (2.03/2.41) 0.138/0.155 (3.51/3.94) B Min./Max. 0.115/0.135 (2.92/3.43) 0.180/0.200 (4.57/5/08) C Min./Max. 0.008/0.030 (0.203/0.762) Description The MA4P1250 and MA4P1450 are square surface mountable PIN diodes in a non-rollable, metal electrode leadless faced (MELF) package. They incorporate passivated PIN diode chips that are full face bonded to refractory metal pins. These parts utilize M/A-COM’s HIPAX technology in a low inductance ceramic package with no ribbons or whisker wires. The package is hermetically sealed at temperatures exceeding 300˚C. Applications The MA4P1250 is designed for use as a low loss switching element from HF through UHF. Its high power rating allows performance in antenna switch elements at RF power levels greater than 100 watts CW. It is designed to meet the low distortion requirements of mobile radios. The MA4P1450 is a higher power diode. It has lower distortion at RF CW power greater than 10 watts and can dissipate 7.5 watts. FULL FACE BOND PASSIVATED PIN DIODE CHIP Designed for Automated Assembly These surface mount PIN diodes are designed for high volume tape and reel assembly. The square package ea...