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PEB20571 Dataheets PDF



Part Number PEB20571
Manufacturers Infineon Technologies AG
Logo Infineon Technologies AG
Description DSP Embedded Line and Port Interface Controller
Datasheet PEB20571 DatasheetPEB20571 Datasheet (PDF)

ICs for Communications DSP Embedded Line and Port Interface Controller DELIC-LC PEB 20570 Version 2.1 DELIC-PB PEB 20571 Version 2.1 Preliminary Data Sheet 2003-08 DS 1.1 PEB 20570 PEB 20571 Revision History: Previous Version: Page Page (in previous (in current Version) Version) Current Version: 2003-08 07.99 Subjects (major changes since last revision) Trademarks changed For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infin.

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Document
ICs for Communications DSP Embedded Line and Port Interface Controller DELIC-LC PEB 20570 Version 2.1 DELIC-PB PEB 20571 Version 2.1 Preliminary Data Sheet 2003-08 DS 1.1 PEB 20570 PEB 20571 Revision History: Previous Version: Page Page (in previous (in current Version) Version) Current Version: 2003-08 07.99 Subjects (major changes since last revision) Trademarks changed For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com ABM®, AOP®, ARCOFI®, ARCOFI®-BA, ARCOFI®-SP, DigiTape®, EPIC®-1, EPIC®-S, ELIC®, FALC®54, FALC®56, FALC®-E1, FALC®-LH, IDEC®, IOM®, IOM®-1, IOM®-2, IPAT®-2, ISAC®-P, ISAC®-S, ISAC®-S TE, ISAC®-P TE, ITAC®, IWE®, MUSAC®-A, OCTAT®-P, QUAT®-S, SICAT®, SICOFI®, SICOFI®-2, SICOFI®-4, SICOFI®-4µC, SLICOFI® are registered trademarks of Infineon Technologies AG. ACE™, ASM™, ASP™, POTSWIRE™, QuadFALC™, SCOUT™ are trademarks of Infineon Technologies AG. Note: OCEM® and OakDSPCore® (OAK®) are registered trademarks of ParthusCeva, Inc.. Edition 2003-08 Published by Infineon Technologies AG, TR, Balanstraße 73, 81541 München © Infineon Technologies AG 5/8/03. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components1 of the Infineon Technologies AG, may only be used in life-support devices or systems2 with the express written approval of the Infineon Technologies AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. DELIC Preface This document provides reference information on the DELIC-PB and -LC version 2.1. Organization of this Document This Preliminary Data Sheet is divided into 11 chapters and appendices. It is organized as follows: • Chapter 1, Introduction Gives a general description of the product and its family, lists the key features, and presents some typical applications. • Chapter 2, Pin Description Lists pin locations with associated signals, categorizes signals according to function, and describes signals. • Chapter 3, Interface Description Describes the DELIC external interfaces. • Chapter 4, Functional IC Description Describes the features of the main functional blocks. • Chapter 5, Memory Structure • Chapter 6, Register Descriptions Containes the detailed register description. • Chapter 7, Package Outlines • Chapter 8, Electrical Characteristics Containes the DC specification. • Chapter 9, Timing Diagrams Contains the AC specification (as far as available). • Chapter 10, Application Hints • Chapter 11, Mailbox Protocol Description Describes the communication protocol to an external µP. Preliminary Data Sheet III 2003-08 DELIC Your Comments We welcome your comments on this document as we are continuously aiming at improving our documentation. Please send your remarks and suggestions by e-mail to [email protected] Please provide in the subject of your e-mail: device name (DELIC-LC/ -PB), device number (PEB 20570/ PEB 20571), device version (Version 2.1), or and in the body of your e-mail: document type (Preliminary Data Sheet), issue date (2003-08) and document revision number (DS 1.1). Preliminary Data Sheet IV 2003-08 DELIC PEB 20571 Table of Contents 1 1.1 1.2 2 2.1 2.2 2.3 2.4 2.5 3 3.1 3.2 3.2.1 3.2.2 3.2.2.1 3.2.2.2 3.2.3 3.2.3.1 3.2.3.2 3.2.4 3.2.4.1 3.2.4.2 3.3 3.3.1 3.4 3.4.1 3.4.2 3.4.3 3.4.4 3.5 3.5.1 3.5.2 4 4.1 4.2 4.2.1 4.2.2 4.2.3 4.2.4 4.2.4.1 4.2.4.2 Page Introduction . . . . . . . . . . . . . . . . . . . . . .


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