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HYS64V16300GU-8-C2 Dataheets PDF



Part Number HYS64V16300GU-8-C2
Manufacturers Infineon
Logo Infineon
Description 3.3 V 16M x 64/72-Bit 1 Bank 128MByte SDRAM Module 3.3 V 32M x 64/72-Bit 2 Bank 256MByte SDRAM Module 168-Pin Unbuffered DIMM Modules
Datasheet HYS64V16300GU-8-C2 DatasheetHYS64V16300GU-8-C2 Datasheet (PDF)

HYS 64/72V16300/32220GU SDRAM-Modules 3.3 V 16M x 64/72-Bit 1 Bank 128MByte SDRAM Module 3.3 V 32M x 64/72-Bit 2 Bank 256MByte SDRAM Module 168-Pin Unbuffered DIMM Modules • 168-Pin unbuffered 8-Byte Dual-In-Line SDRAM Modules for PC main memory applications • PC100-222, PC133-333 and PC133-222 versions • 1 bank 16M × 64, 16M × 72 and 2 bank 32M × 64, 32M × 72 organzation • Optimized for byte-write non-parity (x64) or ECC (x72) applications • JEDEC standard Synchronous DRAMs (SDRAM) • Fully PC .

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HYS 64/72V16300/32220GU SDRAM-Modules 3.3 V 16M x 64/72-Bit 1 Bank 128MByte SDRAM Module 3.3 V 32M x 64/72-Bit 2 Bank 256MByte SDRAM Module 168-Pin Unbuffered DIMM Modules • 168-Pin unbuffered 8-Byte Dual-In-Line SDRAM Modules for PC main memory applications • PC100-222, PC133-333 and PC133-222 versions • 1 bank 16M × 64, 16M × 72 and 2 bank 32M × 64, 32M × 72 organzation • Optimized for byte-write non-parity (x64) or ECC (x72) applications • JEDEC standard Synchronous DRAMs (SDRAM) • Fully PC board layout compatible to INTEL’s Rev. 1.0 Module Specification • SDRAM Performance: -7 /-7.5 PC133 fCK Max. Clock • Programmed Latencies: Product Speed -7 -7.5 -8 PC133-222 PC133-333 PC100-222 CL 2 3 2 tRCD tRP 2 3 2 2 3 2 • Single +3.3 V( ±0.3 V) Power Supply • Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential and Interleave) • Auto-Refresh (CBR) and Self-Refresh • Decoupling capacitors mounted on substrate • All inputs and outputs are LVTTL compatible • Serial Presence Detect with E2PROM -8 PC100 100 6 Unit MHz ns 133 5.4 • Utilizes 16M × 8 SDRAMs in TSOPII-54 packages with 4096 refresh cycles every 64 ms • 133.35 mm × 31.75 mm × 4,00 mm card size with gold-contact pads (JEDEC MO-161-BA) Frequency tAC Clock Access Time Description The HYS 64(72)V16300GU and HYS 64(72)V32220GU are industry-standard 168-pin 8-byte Dual In-line Memory Modules (DIMMs) which are organized as 16M × 64, 16M × 72 in 1 bank and 32M × 64 and 32M × 72 in two banks of high-speed memory arrays designed with 128Mbit Synchronous DRAMs (SDRAMs) for non-parity and ECC applications. The DIMMs use -7 speed sorted 16M × 8 SDRAM devices in TSOP54 packages to meet the PC133-222 requirements, -7.5 speed sorted for PC133-333 and use -8 components for the standard PC100-222 applications. Decoupling capacitors are mounted on the PC board. The PC board design is in accordance with INTEL’s Module Specification. The DIMMs have Serial Presence Detect, implemented with a serial E 2PROM using the two-pin I2C protocol. The first 128 bytes are utilized by the DIMM manufacturer and the second 128 bytes are available to the end user. All INFINEON 168-pin DIMMs provide a high performance, flexible 8-byte interface in a 133.35 mm long footprint, with 1.25“ (31.75 mm) height. INFINEON Technologies 1 9.01 HYS 64/72V16300/32220GU SDRAM-Modules Ordering Information Type 128 MByte DIMMs HYS 64V16300GU-7-C2 PC133-222-520 L-DIM-168-33 133 Mhz 16M × 64 1 bank SDRAM module 1.25“ 1.25“ 1.25“ 1.25“ 1.25“ 1.25“ Code Package Descriptions Module Height HYS 64V16300GU-7.5-C2 PC133-333-520 L-DIM-168-33 133 Mhz 16M × 64 1 bank SDRAM module HYS 64V16300GU-8-C2 HYS 72V16300GU-7-C2 PC100-222-620 L-DIM-168-33 100 MHz 16M × 64 1 bank SDRAM module PC133-222-520 L-DIM-168-33 133 Mhz 16M × 72 1 bank SDRAM module HYS 72V16300GU-7.5-C2 PC133-333-520 L-DIM-168-33 133 Mhz 16M × 72 1 bank SDRAM module HYS 72V16300GU-8-C2 256 MByte DIMMs HYS 64V32220GU-7-C2 PC133-222-520 L-DIM-168-30 133 MHz 32M × 64 2 bank SDRAM module PC100-222-620 L-DIM-168-33 100 MHz 16M × 72 1 bank SDRAM module 1.25“ 1.25“ 1.25“ 1.25“ 1.25“ 1.25“ HYS 64V32220GU-7.5-C2 PC133-333-520 L-DIM-168-30 133 MHz 32M × 64 2 bank SDRAM module HYS 64V32220GU-8-C2 HYS 72V32220GU-7-C2 PC100-222-620 L-DIM-168-30 100 MHz 32M × 64 2 bank SDRAM module PC133-222-520 L-DIM-168-30 133 Mhz 32M × 72 2 bank SDRAM module HYS 72V32220GU-7.5-C2 PC133-333-520 L-DIM-168-30 133 Mhz 32M × 72 2 bank SDRAM module HYS 72V32220GU-8-C2 PC100-222-620 L-DIM-168-30 100 Mhz 32M × 72 2 bank SDRAM module Note: All part numbers end with a place code, designating the die revision. Consult factory for current revision. Example: HYS 64V16300GU-8-C2, indicates that Rev.C2 dies are used for SDRAM components. INFINEON Technologies 2 9.01 HYS 64/72V16300/32220GU SDRAM-Modules Pin Definitions and Functions A0-A11 BA0, BA1 CB0-CB7 RAS CAS Address Inputs Bank Selects Check Bits (x72 modules only) Column Address Strobe WE CKE0, CKE1 *) CLK0 - CLK3 Read/Write Input V SS Clock Enable Clock Input Ground SCL Clock for SPD SDA Serial Data Out N.C. No Connection – – – – DQ0 - DQ63 Data Input/Output DQMB0 - DQMB7 Data Mask Chip Select Power (+3.3 V) Row Address Strobe CS0 - CS3 *) VDD *) CKE1, CS1 and CS3 on two bank modules only Address Format Part Number 16M × 64 HYS 64V16300GU 16M × 72 HYS 72V16300GU 32M × 64 HYS 64V32220GU 32M × 72 HYS 72V32220GU Rows 12 12 12 12 Columns 10 10 10 10 Bank Select 2 2 2 2 Refresh Period Interval 4k 4k 4k 4k 64 ms 64 ms 64 ms 64 ms 15,6 µs 15,6 µs 15,6 µs 15,6 µs Pin Configuration PIN# Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 PIN# 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 Symbol PIN# 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 Symbol PIN# 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 Symbol VSS DQ0 DQ1 DQ2 DQ3 VSS DU CS2 DQMB2 DQMB3 DU VSS DQ32 DQ33 DQ34 DQ35 VSS CKE0 CS3 DQMB6 DQMB7 N.C. VDD DQ4 DQ5 DQ6 DQ7 DQ8 VDD DQ36 DQ37 DQ38 DQ39 DQ40 VDD N.C. N.C. N.C. (CB2) N.C. (C.


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