Document
TD62783,784AP/F/AF
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62783AP,TD62783F,TD62783AF TD62784AP,TD62784F,TD62784AF
8CH HIGH−VOLTAGE SOURCE DRIVER
The TD62783AP / F / AF Series are comprised of eight source current Transistor Array. These drivers are specifically designed for fluorescent display applications. Applications include relay, hammer and lamp drivers.
FEATURES
l High output voltage Type−AP, AF : VCC = 50 V MIN.
Type−F
: VCC = 35 V MIN.
l Output current (single output) IOUT = −500 mA MIN.
l Output clamp diodes
l Single supply voltage
l Input compatible with various types of logic
l Package Type−AP : DIP−18 pin
l Package Type−F, AF : SOP−18 pin
TYPE
TD62783AP / F / AF TD62784AP / F / AF
DESIGNATION
TTL, 5 V CMOS 6~15 V PMOS, CMOS
PIN CONNECTION (TOP VIEW)
Weight DIP18−P−300−2.54D : 1.47 g (Typ.) SOP18−P−375−1.27 : 0.41 g (Typ.)
SCHEMATICS (EACH DRIVER)
Note: The input and output parasitic diodes cannot be used as clamp diodes.
1 2001-07-05
MAXIMUM RATINGS (Ta = 25°C)
TD62783,784AP/F/AF
CHARACTERISTIC
SYMBOL
RATING
UNIT
Supply Voltage Output Current
AP, AF F
Input Voltage
Clamp Diode Reverse Voltage
AP, AF F
Clamp Diode Forward Current
Power Dissipation
AP F, AF
Operating Temperature
Storage Temperature
VCC
IOUT VIN (Note 1) VIN (Note 2)
VR
IF
PD (Note 3)
Topr Tstg
50 35 −500 15 30 50 35 500 1.47 0.96 −40~85 −55~150
V mA / ch
V
V mA W °C °C
Note 1: Only TD62783AP / F / AF Note 2: Only TD62784AP / F / AF Note 3: Delated above 25°C in the proportion of 11.7 W / °C (AP Type), 7.7 W / °C (F, AF Type)
RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C)
CHARACTERISTIC
Supply Voltage
AP, AF F
Output Current
AF, F
Input Voltage
TD62783AP / F / AF TD62784AP / F / AF
Input Voltage
Output On
Output Off
TD62783AP / F / AF TD62784AP / F / AF TD62783AP / F / AF TD62784AP / F / AF
Clamp Diode Reverse Voltage
AP F, AF
Clamp Diode Forward Current
Power Dissipation
AP F, AF
SYMBOL VCC
IOUT
VIN VIN (ON) VIN (OFF)
VR IF PD
TEST CONDITION
MIN
― ― Duty = 10% 8Circuits Ta = 85°C Duty = 50% 8Circuits Tj = 120°C Tpw = 25ms Duty = 10% 8Circuits Duty = 50% 8Circuits ― ― ― ― ― ― ― ― ― ― ―
― ― ― ― ― ― ― ― 2.0 4.5 0 0 ― ― ― ― ―
TYP.
― ― ― ― ― ― ― ― 5.0 12.0 ― ― ― ― ― ― ―
MAX UNIT
50 35 −260 −59 −180 −38 12 24 15 30 0.8 2.0 50 35 400 0.52 0.35
V
mA / ch
V
V
V mA W
2 2001-07-05
TD62783,784AP/F/AF
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC Output Leakage Current
Output Saturation Voltage
Input Current
Input Voltage
TD62783AP / F / AF
TD62784AP / F / AF
TD62783AP / F / AF TD62784AP / F / AF TD62783AP / F / AF TD62784AP / F / AF
SYMBOL ICEX
VCE (sat)
IIN (ON) VIN (ON) VIN (OFF)
TEST CIR− CUIT
TEST CONDITION
1
VCC = VCC MAX. VIN = 0.4 V Ta = 25°C
VIN = VIN (ON), IOUT = −350 mA
2
VIN = VIN (ON), IOUT = −225 mA
VIN = VIN (ON), IOUT = −100 mA
VIN = 2.4 V
3 VIN = 3.85 V VIN = 5 V
VIN = 12 V
VCE = 2.0 V
4 IOUT = −350 mA
IOUT = −500 µA
Supply Current
Clamp Diode Reverse Current
AP, AF F
Clamp Diode Forward Voltage
Turn−On Delay
Turn−Off Delay
ICC (ON)
IR
VF tON tOFF
3 VIN = VIN (ON), VCC = 50 V
5 VR = 50 V VR = 35 V
6 IF = 350 mA
7
VCC = VCC MAX. RL = 125 Ω CL = 15 pF, RL = 88 Ω (F)
MIN TYP. MAX UNIT
― ― 100 µA
― ― 2.0
― ― 1.9 V
― ― 1.8
― 36 52
― 180 260 µA
― 92 130
― 790 1130
― ― 2.0
― ― 4.5
V
0.8 ―
―
2.0 ―
―
―
―
2.5
mA / ch
― ― 50 µA
― ― 50
― ― 2.0 V
― 0.15 ― ― 1.8 ―
µs
3 2001-07-05
TEST CIRCUIT 1. ICEX 3. IIN (ON), ICC
5. IR
7. tON, tOFF
2. VCE (sat)
TD62783,784AP/F/AF
4. VIN (ON), VIN (OFF)
6. VF
Note 1: Pulse width 50 µs, duty cycle 10% Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance
PRECAUTIONS for USING
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
4 2001-07-05
TD62783,784AP/F/AF
5 2001-07-05
TD62783,784AP/F/AF
6 2001-07-05
PACKAGE DIMENSIONS
DIP18−P−300−2.54D
TD62783,784AP/F/AF
Unit: mm
Weight: 1.47 g (Typ.)
7 2001-07-05
PACKAGE DIMENSIONS
SOP18−P−375−1.27
TD62783,784AP/F/AF
Unit: mm
Weight: 0.41 g (Typ.)
8 2001-07-05
TD62783,784AP/F/AF
RESTRICTIONS ON PRODUCT USE
000707EBA
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure.