Document
TD62708N
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62708N
8CH HIGH CURRENT SOURCE DRIVER
The TD62708N is comprised of eight source current output stages and ENABLE inputs which can gate the outputs. TD62708N features a large output source current of 1.8 A and minimized output voltage change vs output current change. These features make the device optimum for driving the matrix of ink jet printer print heads, LEDs, and the scan side of resistor matrixes. Before using this device, note the thermal conditions for usage.
FEATURES
Input terminal : High active
Enable terminal : Low input output active mode
Output current : IOUT = 1.8 A (MAX)
A little change of output voltage
: ∆VOH1 ≤ 0.45 V (at IOH = 0.18 A~1.44 A)
Package type
: DIP24N
Input compatible with TTL, 5 V CMOS
Weight: 1.2 g (typ.)
PIN CONNECTION (TOP VIEW)
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SCHEMATICS (EACH DRIVER)
TD62708N
FUNCTION IN
H L Don’t Care
ENABLE
L L H
OUT
ON OFF OFF
* 1: For normal use, connect VCC2 and VC. For applications whose thermal conditions are more demanding, TOSHIBA recommends an external resistor (REXT : approx. 0.9 Ω / 2W) be connected between VCC2 and VC.
* 2: When connecting an external resistor between BVCC2 and VC, to avoid parasitic sub currents, set the voltage between VC and OUT as 0.3 V or more. Set the external resistor value so that the voltage between VC and OUT is 0.3 V or more at the maximum temperature of the operating temperature range.
INPUT CIRCUIT : IN, ENABLE
Note:
Since the states of the input pins (pins 3 to 10) are the same as those at high-level input, set the pins for unused channels to GND.
Output voltage (Temperature characteristic) Output Voltage (VOH) has a Temperature Characteristic of 5.8 mV / °C, care must be taken to keep Junction Temp (Tj) within safety Limits.
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MAXIMUM RATINGS (Ta = 25°C)
TD62708N
CHARACTERISTIC
SYMBOL
RATING
UNIT
Supply Voltage 1 Supply Voltage 2 Output Current Input Voltage Input Current Power Dissipation Janction Temperature Operating Temperature Storage Temperature
VCC1 VCC2 IOUT VIN
IIN PD Tj Topr Tstg
−0.5~7.0 −0.5~40 1.8 (Note) −0.5~7.0
±4.0 1.78 150 −40~85 −55~150
V
A V mA W °C °C °C
Note 1: 1.8 A / ch (32 µs, Duty ≤ 76%), Each Channel should not be switched on at same time. Note 2: When mounting the device on the PC board, and the temperature exceeds 25°C, derate to 14.2 mW / °C.
RECOMMENDED OPERATING CONDITIONS
CHARACTERISTIC
SYMBOL
CONDITION
Supply Voltage 1 Supply Voltage 2 Output Current
Input Voltage
Operating Temperature
VCC1 VCC2 IOH (Note) VIN (H) VIN (L) VEN (H) VEN (L) Topr
― ― ― VIN = H, VCC1 = 5.0 V VIN = L, VCC1 = 5.0 V VEN = H, VCC1 = 5.0 V VEN = L, VCC1 = 5.0 V ―
Note: Each Channel should not be switched on at same time.
MIN TYP. MAX UNIT
4.5 5.0 5.5 ― ― 30
V
― ― 1.44 A
2.4 ― VCC V 0 ― 0.4 V
2.4 ― VCC V 0 ― 0.4 V
0 ― 70 °C
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TD62708N
ELECTRICAL CHARACTERISTICS (Ta = 0~70°C)
CHARACTERISTIC Leakage Current
Input Current
SYMBOL
IL1 IL2 IL3 IIN1 IIN2 IEN1 IEN2
TEST CIR− CUIT
TEST CONDITION
VCC1 = 7.0 V, IN = L, EN = H
― VCC2 = 30 V, IN = L, EN = H
VC = 30 V, IN = L, EN = H
VCC1 = 5.0 V, VIN = 5.0 V
― VCC1 = 5.0 V, VIN = 0 V VCC1 = 5.0 V, VEN = 5.0 V
VCC1 = 5.0 V, VEN = 0 V
VINH
VCC1 = 5.0 V
Input Voltage
VINL VENH
VCC1 = 5.0 V ―
VCC1 = 5.0 V
Output Voltage Change Of Output Voltage Output Voltage Temperature Characteristic
Propagation Delay Time
Rise Time Fall Time
VENL
VOH1 VOH2 ∆VOH1
∆VCE2
tpLH1 tpLH2 tpHL1 tpHL2
tr1 tr2 tf1 tf2
VCC1 = 5.0 V
― IOH = 1.44 A IOH = 0.18 A
VCC2 = 30 V
― VOH1 − VOH2 (Tj = 25°C)
―
VOH (Tj = 105°C) − VOH (Tj = 25°C) IOH = 0.18 A
IOUT = 0.18 A
―
VCC1 = VIN = 4.5 V VCC2 = 30 V
IOUT = 1.44 A IOUT = 0.18 A
IOUT = 1.44 A
IOUT = 0.18 A
―
VCC1 = VIN = 4.5 V VCC2 = 30 V
IOUT = 1.44 A IOUT = 0.18 A
IOUT = 1.44 A
MIN TYP.
― ― ― ― 0.55 ― 0.55
― ― ― 0 0.8 0 0.8
2.0 ―
GND −0.4
―
2.0 ―
GND −0.4
27.0
27.5
―
―
27.5 28.0 0.3
― 0.5
― 0.1 ― 0.2 ― 1.0 ― 1.5 ― 0.05 ― 0.1 ― 0.3 ― 0.3
MAX UNIT
100 100 100 10 1.1 10 1.1 VCC +0.4
µA
µA mA µA mA
0.8 VCC +0.4 0.8 ― ― 0.45
V
V V
―V
1.0 1.0 3.5 3.5
µs 0.5 0.5 2.0 2.0
AC TEST CIRCUIT
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TD62708N
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TD62708N
Thermal calculation Where, power dissipation = (VCC1 × ICC1) + (VCC2 × ICC2 × ch × Duty) + (VOH × IOH × ch × Duty) and the transient thermal resistance of DIP24N (R + h) = 70°C / W, the junction temperature (Tj) is :
Tj (MAX) ≥ (PD × R + h) + Ta (MAX) ··············· expression (A)
Conditions:VCC1 = 5 V (ICC1 = approx. 8 mA), VCC2 = 30 V (ICC2 = approx. 5 mA), 1ch on VOH = approx. 2.0 V, IOH = 1.44 A, Tj (MAX) = 120°C, ambient temperature (MAX) : Ta = 70°C
(1) When VCC2 and VC are connected: Due to expression (a), for designs without cooling fins, duty = approx. 20% is required, as the following calculation shows :
PD = (5 V × 8 mA) + (30 V × 5 mA × 1ch × 0.2) + (2.0 V × 1.44 A × 1ch × 0.2)
= 40 mW + 30 mW + 576 mW
= 646 mW
Tj (MAX) ≥ (646 mW × 70°C / W) + 70°C.