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TD62388AP Dataheets PDF



Part Number TD62388AP
Manufacturers Toshiba
Logo Toshiba
Description 8CH LOW INPUT ACTIVE DARLINGTON SINK DRIVER
Datasheet TD62388AP DatasheetTD62388AP Datasheet (PDF)

TD62386,387,388AP/AF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62386AP,TD62386AF,TD62387AP TD62387AF,TD62388AP,TD62388AF 8 CH LOW INPUT ACTIVE DARLINGTON SINK DRIVER The TD62386AP, TD62386AF, TD62387AP, TD62387AF and TD62388AP, TD62388AF are non−inverting transistor arrays, which are comprised of eight NPN darlington output stages and PNP input stages. All units feature integral clamp diodes for switching inductive loads. These devices are Low Level input active drivers an.

  TD62388AP   TD62388AP


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TD62386,387,388AP/AF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62386AP,TD62386AF,TD62387AP TD62387AF,TD62388AP,TD62388AF 8 CH LOW INPUT ACTIVE DARLINGTON SINK DRIVER The TD62386AP, TD62386AF, TD62387AP, TD62387AF and TD62388AP, TD62388AF are non−inverting transistor arrays, which are comprised of eight NPN darlington output stages and PNP input stages. All units feature integral clamp diodes for switching inductive loads. These devices are Low Level input active drivers and are suitable for operations with TTL, 5 V CMOS and 5 V Microprocessor which have sink current output drivers. Applications include relay, hammer, lamp and LED driver. FEATURES l Output current (single output) 500 mA (Max) l High sustaining voltage 50 V (Min) l Output clamp diodes l Low level active input l Standard supply voltage l Inputs compatible with TTL and 5 V CMOS l Package type−AP: DIP−20 pin l Package type−AF: SOP−20 pin TYPE TD62386AP, TD62386AF TD62387AP, TD62387AF TD62388AP, TD62388AF VIN (ON) −20 V~VCC − 2.8 V 0 V~VCC − 3.7 V PIN CONNECTION (TOP VIEW) Weight DIP20−P−300−2.54A : 2.25 g (Typ.) SOP20−P−300−1.27 : 0.25 g (Typ.) 1 2001-07-04 SCHEMATICS (EACH DRIVER) TD62386AP,TD62386AF TD62386,387,388AP/AF TD62387AP, TD62387AF TD62388AP,TD62388AF Note: The output parasitic diode cannot be used as clamp diodes. MAXIMUM RATINGS CHARACTERISTIC SYMBOL RATING UNIT Supply Voltage Output Sustaining Voltage Output Current AP AF Input Voltage Input Current Clamp Diode Reverse Voltage Clamp Diode Forward Current Power Dissipation AP AF Operating Temperature Storage Temperature VCC VCE (SUS) IOUT VIN (Note 1) VIN (Note 2) IIN VR IF PD (Note 3) Topr Tstg −0.5~7.0 −0.5~50 −0.5~35 500 −22~VCC + 0.5 −0.5~7 −10 50 500 1.38 1.0 (Note 4) −40~85 −55~150 V V mA / ch V mA V mA W °C °C Note 1: TD62386AP, TD62386AF only Note 2: TD62387AP, TD62387AF, TD62388AP, TD62388AF only Note 3: Delated above 25°C in the proportion of 11.7 mW / °C (AP−Type), 7.7 mW / °C (F, AF−Type). Note 4: On PCB (50 × 50 × 1.6 mm Cu 40% Glass Epoxy) 2 2001-07-04 TD62386,387,388AP/AF RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C) CHARACTERISTIC SYMBOL CONDITION Supply Voltage Output Sustaining Voltage Output Current TD62386AP TD62386AF Input Voltage TD62387AP TD62387AF TD62388AP TD62388AF Clamp Diode Reverse Voltage Clamp Diode Forward Current Power Dissipation AP AF VCC VCE (SUS) IOUT ― ― Tpw = 25 ms, Duty = 10% 8 Circuits ― VIN ― VR ― IF ― ― PD Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%) MIN TYP. MAX UNIT 4.5 5.0 5.5 V 0 ― 50 V 0 ― 270 mA / ch −20 ― VCC V 0 ― 5.5 (Note 1) ― ― ― ― ― 50 V ― 400 mA ― 0.52 W ― 0.4 ELECTRICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC Output Leakage Current Output Saturation Voltage Input Current Input Voltage (Output on) Output On Output Off TD62386AP TD62386AF TD62387AP TD62387AF TD62388AP TD62388AF Clamp Diode Reverse Current Clamp Diode Forward Voltage Supply Current Turn−On Delay Turn−Off Delay SYMBOL ICEX VCE (sat) IIN (ON) IIN (OFF) TEST CIR− CUIT TEST CONDITION 1 VCC = 5.5 V, IIN = 0 VOUT = 50 V, Ta = 85°C VCC = 4.5 V, 2 VIN = VIN (ON) MAX. IOUT = 350 mA 3 VCC = 5.5 V, VIN = 0.4 V VCC = 5.5 V, VIN = −20 V 4― ― VIN (ON) 5 ― IR VF ICC (ON) ICC (OFF) tON tOFF 6 VR = 50 V, Ta = 25°C VR = 50 V, Ta = 85°C 7 IF = 350 mA IF = 280 mA 8 VCC = 5.5 V, VIN = 0 VCC = 5.5 V, VIN = VCC 9 VCC = 5 V, VOUT = 50 V RL = 125Ω, CL = 15 pF MIN TYP. MAX UNIT ― ― 100 µA ― 1.4 2.0 V ― −0.32 −0.45 mA ― ― −2.6 ― ― −4.0 µA ― ― VCC − 2.8 V ― ― VCC − 3.7 ― ― 50 µA ― ― 100 ― ― 2.0 V ― ― 1.8 ― 17 22 mA ― ― 100 µA ― 0.1 ― µs ―3― 3 2001-07-04 TEST CIRCUIT 1. ICEX 3. IIN (ON) 5. VIN (ON) 7. VF 9. tON, tOFF TD62386,387,388AP/AF 2. VCE (sat) 4. IIN (OFF) 6. IR 8. ICC Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns Note 2: CL includes probe and jig capacitance. PRECAUTIONS for USING This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 4 2001-07-04 TD62386,387,388AP/AF 5 2001-07-04 TD62386,387,388AP/AF 6 2001-07-04 PACKAGE DIMENSIONS DIP20−P−300−2.54A TD62386,387,388AP/AF Unit: mm Weight: 2.25 g (Typ.) 7 2001-07-04 PACKAGE DIMENSIONS SOP20−P−300−1.27 TD62386,387,388AP/AF Unit: mm Weight: 0.25 g (Typ.) 8 2001-07-04 TD62386,387,388AP/AF RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability .


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