Document
TD62318BP/BF
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62318BP,TD62318BF
4CH LOW INPUT ACTIVE HIGH−CURRENT DARLINGTON SINK DRIVER
The TD62318BP and TD62318BF are non−inverting transistor array which are comprised of four NPN darlington output stages and PNP input stages. This device is low level input active driver and are suitable for operation with TTL, 5 V CMOS and 5 V Microprocessor which have sink current output drivers. Applications include relay, hammer, lamp and stepping motor drivers.
FEATURES
l Two VCC Terminals VCC1, VCC2 (Separated) l Package Type BP : DIP−16 pin
BF : HSOP−16 pin l High Sustaining Voltage Output : VCE (SUS) = 80 V (Min.) l Output Current (Single Output) : IOUT = 700 mA / ch (Max.) l Output Clamp Diodes l Input Compatible with TTL and 5 V CMOS l GND and SUB Terminal = Heat Sink l Low Level Active Input l Standard Supply Voltage
Weight DIP16−P−300−2.54A : 1.11 g (Typ.) HSOP16−P−300−1.00 : 0.50 g (Typ.)
1 2001-06-28
PIN CONNECTION (TOP VIEW)
TD62318BP
TD62318BP/BF
SCHEMATICS (EACH DRIVER)
TD62318BF
Note: The input and output parasitic diode cannot be used as clamp diode.
MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
Supply Voltage Output Sustaining Voltage Output Current Input Current Input Voltage Clamp Diode Reverse Voltage Clamp Diode Forward Current
Power Dissipation
BP BF
Operating Temperature Storage Temperature
VCC VCE (SUS)
IOUT IIN VIN VR IF
PD
Topr Tstg
−0.5~17 −0.5~80
700 −10 −0.5~17 80
700 1.47 / 2.7 (Note 1) 0.9 / 1.4 (Note 2) −40~85
−55~150
Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
UNIT V V
mA / ch mA V V mA
W
°C °C
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RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C)
TD62318BP/BF
CHARACTERISTIC
SYMBOL
CONDITION
MIN TYP. MAX UNIT
Supply Voltage Output Sustaining Voltage
VCC VCE (SUS)
DC 1 circuit, Ta = 25°C
4.5 ― 5.5 V 0 ― 50 V 0 ― 570
Output Current
BP (Note 1) BP (Note 2)
IOUT
Tpw = 25 ms 4 circuits
Tj = 120°C Ta = 85°C
Duty = 10% Duty = 50% Duty = 10% Duty = 50%
0 ― 570 0 ― 330 mA / ch 0 ― 570 0 ― 100
Input Voltage
Output On Output Off
VIN VIN (ON) VIN (OFF)
0 ― 15 V
0
―
VCC −3.6
V
VCC −3.6
―
5.5
Clamp Diode Reverse Voltage
Clamp Diode Forward Current
Power Dissipation
BP BF
VR IF
Ta = 85°C PD
Ta = 85°C
(Note 1) (Note 2)
― ― ― ―
― 80
V
― 700 mA
― 1.4 W
― 0.7
Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC
SYMBOL
TEST CIR− CUIT
TEST CONDITION
Input Voltage
"H" Level "L" Level
VIH ―
VIL
Input Current
"H" Level "L" Level
Output Leakage Current
Output Saturation Voltage
Clamp Diode Reverse Current
Clamp Diode Forward Voltage
Supply Current
Output On Output Off
Turn−On Delay
Turn−Off Delay
IIH IIL
ICEX
VCE (sat)
IR
VF ICC (ON) ICC (OFF)
tON tOFF
2
1 VCE = 80 V, Ta = 25°C VCE = 80 V, Ta = 85°C
3 IOUT = 0.5 A, VCC = 4.5 V IOUT = 0.2 A, VCC = 4.5 V
4 VR = 80 V, Ta = 25°C VR = 80 V, Ta = 85°C
5 IF = 500 mA 2 VCC = 5.5 V, VIN = 0 V 2 VCC = 5.5 V, VIN = VCC
6
VOUT = 80 V, RL = 142 Ω VCC = 5.0 V, CL = 15 pF
MIN TYP. MAX UNIT
VCC −1.6
0
― ― ― ― ― ― ― ― ― ― ― ― ―
―
―
― −0.05
― ― ― ― ― ― ― 35 ― 0.4 8.0
15 VCC −3.6
V
10 µA
−0.36 mA
50 µA
100
0.8 V
0.45
50 µA
100
2.0 V
40 mA / ch
10 µA
0.8 µs
16.0
3 2001-06-28
TEST CIRCUIT 1. ICEX
3. VCE (sat)
5. VF
2. IIH, IIL 4. IR 6. tON, tOFF
TD62318BP/BF
Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance.
PRECAUTIONS for USING
This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
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TD62318BP/BF
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TD62318BP/BF
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PACKAGE DIMENSIONS
DIP16−P−300−2.54A
TD62318BP/BF
Unit: mm
Weight: 1.11 g (Typ.)
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PACKAGE DIMENSIONS
HSOP16−P−300−1.00
TD62318BP/BF
Unit: mm
Weight: 0.50 g (Typ.)
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TD62318BP/BF
RESTRICTIONS ON PRODUCT USE
000707EBA
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing you.