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TD62318BP Dataheets PDF



Part Number TD62318BP
Manufacturers Toshiba
Logo Toshiba
Description 4CH LOW INPUT ACTIVE HIGH-CURRENT DARLNGTON SINK DRIVER
Datasheet TD62318BP DatasheetTD62318BP Datasheet (PDF)

TD62318BP/BF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62318BP,TD62318BF 4CH LOW INPUT ACTIVE HIGH−CURRENT DARLINGTON SINK DRIVER The TD62318BP and TD62318BF are non−inverting transistor array which are comprised of four NPN darlington output stages and PNP input stages. This device is low level input active driver and are suitable for operation with TTL, 5 V CMOS and 5 V Microprocessor which have sink current output drivers. Applications include relay, hammer, lamp and st.

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TD62318BP/BF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62318BP,TD62318BF 4CH LOW INPUT ACTIVE HIGH−CURRENT DARLINGTON SINK DRIVER The TD62318BP and TD62318BF are non−inverting transistor array which are comprised of four NPN darlington output stages and PNP input stages. This device is low level input active driver and are suitable for operation with TTL, 5 V CMOS and 5 V Microprocessor which have sink current output drivers. Applications include relay, hammer, lamp and stepping motor drivers. FEATURES l Two VCC Terminals VCC1, VCC2 (Separated) l Package Type BP : DIP−16 pin BF : HSOP−16 pin l High Sustaining Voltage Output : VCE (SUS) = 80 V (Min.) l Output Current (Single Output) : IOUT = 700 mA / ch (Max.) l Output Clamp Diodes l Input Compatible with TTL and 5 V CMOS l GND and SUB Terminal = Heat Sink l Low Level Active Input l Standard Supply Voltage Weight DIP16−P−300−2.54A : 1.11 g (Typ.) HSOP16−P−300−1.00 : 0.50 g (Typ.) 1 2001-06-28 PIN CONNECTION (TOP VIEW) TD62318BP TD62318BP/BF SCHEMATICS (EACH DRIVER) TD62318BF Note: The input and output parasitic diode cannot be used as clamp diode. MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC SYMBOL RATING Supply Voltage Output Sustaining Voltage Output Current Input Current Input Voltage Clamp Diode Reverse Voltage Clamp Diode Forward Current Power Dissipation BP BF Operating Temperature Storage Temperature VCC VCE (SUS) IOUT IIN VIN VR IF PD Topr Tstg −0.5~17 −0.5~80 700 −10 −0.5~17 80 700 1.47 / 2.7 (Note 1) 0.9 / 1.4 (Note 2) −40~85 −55~150 Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 30%) UNIT V V mA / ch mA V V mA W °C °C 2 2001-06-28 RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C) TD62318BP/BF CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT Supply Voltage Output Sustaining Voltage VCC VCE (SUS) DC 1 circuit, Ta = 25°C 4.5 ― 5.5 V 0 ― 50 V 0 ― 570 Output Current BP (Note 1) BP (Note 2) IOUT Tpw = 25 ms 4 circuits Tj = 120°C Ta = 85°C Duty = 10% Duty = 50% Duty = 10% Duty = 50% 0 ― 570 0 ― 330 mA / ch 0 ― 570 0 ― 100 Input Voltage Output On Output Off VIN VIN (ON) VIN (OFF) 0 ― 15 V 0 ― VCC −3.6 V VCC −3.6 ― 5.5 Clamp Diode Reverse Voltage Clamp Diode Forward Current Power Dissipation BP BF VR IF Ta = 85°C PD Ta = 85°C (Note 1) (Note 2) ― ― ― ― ― 80 V ― 700 mA ― 1.4 W ― 0.7 Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On Glass Epoxy PCB (60 × 30 × 1.6 mm Cu 30%) ELECTRICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC SYMBOL TEST CIR− CUIT TEST CONDITION Input Voltage "H" Level "L" Level VIH ― VIL Input Current "H" Level "L" Level Output Leakage Current Output Saturation Voltage Clamp Diode Reverse Current Clamp Diode Forward Voltage Supply Current Output On Output Off Turn−On Delay Turn−Off Delay IIH IIL ICEX VCE (sat) IR VF ICC (ON) ICC (OFF) tON tOFF 2 1 VCE = 80 V, Ta = 25°C VCE = 80 V, Ta = 85°C 3 IOUT = 0.5 A, VCC = 4.5 V IOUT = 0.2 A, VCC = 4.5 V 4 VR = 80 V, Ta = 25°C VR = 80 V, Ta = 85°C 5 IF = 500 mA 2 VCC = 5.5 V, VIN = 0 V 2 VCC = 5.5 V, VIN = VCC 6 VOUT = 80 V, RL = 142 Ω VCC = 5.0 V, CL = 15 pF MIN TYP. MAX UNIT VCC −1.6 0 ― ― ― ― ― ― ― ― ― ― ― ― ― ― ― ― −0.05 ― ― ― ― ― ― ― 35 ― 0.4 8.0 15 VCC −3.6 V 10 µA −0.36 mA 50 µA 100 0.8 V 0.45 50 µA 100 2.0 V 40 mA / ch 10 µA 0.8 µs 16.0 3 2001-06-28 TEST CIRCUIT 1. ICEX 3. VCE (sat) 5. VF 2. IIH, IIL 4. IR 6. tON, tOFF TD62318BP/BF Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns Note 2: CL includes probe and jig capacitance. PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 4 2001-06-28 TD62318BP/BF 5 2001-06-28 TD62318BP/BF 6 2001-06-28 PACKAGE DIMENSIONS DIP16−P−300−2.54A TD62318BP/BF Unit: mm Weight: 1.11 g (Typ.) 7 2001-06-28 PACKAGE DIMENSIONS HSOP16−P−300−1.00 TD62318BP/BF Unit: mm Weight: 0.50 g (Typ.) 8 2001-06-28 TD62318BP/BF RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing you.


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