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TD62304FB Dataheets PDF



Part Number TD62304FB
Manufacturers Toshiba
Logo Toshiba
Description 7CH LOW INPUT ACTIVE DARLINGTON SINK DRIVER
Datasheet TD62304FB DatasheetTD62304FB Datasheet (PDF)

TD62304,305FB TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62304FB,TD62305FB 7CH LOW INPUT ACTIVE DARLINGTON SINK DRIVER The TD62304FB and TD62305FB are non−inverting transistor arrays, which are comprised of seven NPN darlington buffer-transistor output stages PNP input stages. These devices can be operated by source input voltage and are suitable for operations with a 5-V general purposed logic IC such as 5-V TTL, 5-V CMOS and 5-V Microprocessor which have sink current outp.

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TD62304,305FB TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62304FB,TD62305FB 7CH LOW INPUT ACTIVE DARLINGTON SINK DRIVER The TD62304FB and TD62305FB are non−inverting transistor arrays, which are comprised of seven NPN darlington buffer-transistor output stages PNP input stages. These devices can be operated by source input voltage and are suitable for operations with a 5-V general purposed logic IC such as 5-V TTL, 5-V CMOS and 5-V Microprocessor which have sink current output drivers. Please observe the thermal condition for using. FEATURES l Output current (single output) : 500 mA (Max.) l High sustaining voltage : 35 V (Min.) l Low level active input l Inputs compatible with 5-V TTL and 5-V CMOS l Package type−FB: SOP−16 pin Weight: 0.16 g (Typ.) PIN CONNECTION (TOP VIEW) SCHEMATICS (EACH DRIVER) TD62304FB TD62305FB Note: The input and output parasitic diodes cannot be used as clamp diodes. 1 2001-07-16 MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC SYMBOL RATING Supply Voltage Output Sustaining Voltage Output Current Input Voltage Input Current Power Dissipation Operating Temperature Storage Temperature VCC VCE (SUS) IOUT VIN IIN PD Topr Tstg −0.5~7.0 −0.5~35 500 −22~VCC + 0.5 −0.5~7 (Note 1) −10 0.625 (Note 2) −40~85 −55~150 Note 1: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%) Note 2: TD62305FB only UNIT V V mA / ch V mA W °C °C TD62304,305FB RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C) CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT Supply Voltage Output Sustaining Voltage Output Current Input Voltage Input Voltage (Outout On) TD62304FB TD62305FB TD62304FB TD62305FB Input Voltage (Outout Off) Power Dissipation TD62304FB TD62305FB VCC VCE (SUS) DC 1 Circuit ― ― 4.5 ― 5.5 V 0 ― 35 V 0 ― 400 IOUT Tpw ≤ 25 ms 7 circuits Tj = 120°C Ta = 85°C (Note) Duty = 10% Duty = 50% 0 ― 240 mA / ch 0 ― 60 VIN ― −20 ― VCC V 0 ― 5.5 VIN(ON) ― −22 ― VCC − 3.5 V ― −0.5 ― VCC − 3.7 VIN(OFF) ― VCC − 0.4 ― VCC V ― VCC − 0.6 ― VCC PD (Note) ― ― 0.325 W Note: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%) 2 2001-07-16 TD62304,305FB ELECTRICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC Output Leakage Current Output Saturation Voltage Input Current Input Voltage (Output On) Supply Current Turn−On Delay Turn−Off Delay (Output On) (Output Off) TD62304FB TD62305FB (Output On) (Output Off) SYMBOL ICEX VCE (sat) IIN (ON) IIN (OFF) VIN(ON) ICC (ON) ICC (OFF) tON tOFF TEST CIR− CUIT TEST CONDITION 1 VCC = 5.5 V, VOUT = 35 V Ta = 85°C, IIN = 0 2 VCC = 4.5 V, IOUT = 350 mA VIN = VIN (ON) (Max.) VIN = 0.8 V 3 VCC = 5.5 V, VIN = 0.4 V VCC = 5.5 V, VIN = −20 V 4― MIN ― ― ― ― ― ― ― 5― ― 6 VCC = 5.5 V, VIN = 0 V VCC = VIN = 5.5 V 7 VCC = 5 V, CL = 15 pF VOUT = 35 V, RL = 87.5 Ω ― ― ― ― TYP. MAX UNIT ― −100 µA 1.4 2.0 1.4 −0.32 ― ― ― ― 17 ― 0.1 3 2.2 −0.45 −2.6 −40 VCC −2.8 VCC −3.7 22 100 ― ― V mA µA V mA µA µs 3 2001-07-16 TEST CIRCUIT 1. ICEX 3. IIN (ON) 5. VIN (ON) 7. tON, tOFF 2. VCE (sat) TD62304,305FB 4. IIN (OFF) 6. ICC Note 1: Pulse width 50 µs, duty cycle 10% Output impedance 50 Ω, tr ≤ 10 ns, tf ≤ 5 ns Note 2: CL includes probe and jig capacitance PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed.Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 4 2001-07-16 TD62304,305FB 5 2001-07-16 PACKAGE DIMENSIONS SOP16−P−225−1.27B TD62304,305FB Unit : mm Weight: 0.16 g (Typ.) 6 2001-07-16 TD62304,305FB RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These.


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