W83626F

Winbond W83626F LPC-to-ISA Bridge W83626F/W83626D W83626F/W83626D Data Sheet Revision History Version Pages 1 2 3 4 5 6 7 8 9 1 0 n.a. Dates 02/25/00 Version 0.50 on Web 0.50 Main Contents First published. Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. Publication Release Date:Feb. 2000 Preliminary Revision 0.50 -I - LPC TO ISA BRIDGE SET W83626F/W83626D PRELIMINARY GENERAL DESCRIPTION W83626F/W83626D is a transparent LPC-to-ISA bus conversion IC. For the new generation Intel chipset Camino and Whitney, SiS Super South 960, featuring LPC bus, there is no support for ISA bus and slots. However the demand of ISA devices still exist. For such case, W83626F is the best companion solution for the non-ISA chipset. Also the packages of W83626F had been chosen to be the most economic solution for save the M/B board layout size and cost. For the new generation chipset featuring LPC interface and support no ISA bus, W83627HF (Winbond LPC ...