3 V/ SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUITS
mPC2745TB, mPC2746TB
3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER...
Description
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUITS
mPC2745TB, mPC2746TB
3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
DESCRIPTION The mPC2745TB and mPC2746TB are silicon monolithic integrated circuits designed as buffer amplifier for mobile
communications. These ICs are packaged in super minimold package which is smaller than conventional minimold. The mPC2745TB and mPC2746TB have each compatible pin connections and performance to mPC2745T/ mPC2746T of conventional minimold version. So, in the case of reducing your system size, mPC2745TB/mPC2746TB are suitable to replace from mPC2745T/mPC2746T. nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability.
These ICs are manufactured using NEC’s 20 GHz fT NESATäIII silicon bipolar process. This process uses silicon
FEATURES
High-density surface mounting : 6 pin super minimold package Supply voltage Wideband response High isolation : Recommended VCC = 2.7 to 3.3 V Circuit operation VCC = 1.8 to 3.3 V : fu = 2.7 GHzTYP. @mPC2745TB fu = 1.5 GHzTYP. @mPC2746TB : ISL = 38 dBTYP. @mPC2745TB ISL = 45 dBTYP. @mPC2746TB
APPLICATION
1.5 GHz to 2.5 GHz communication system (PHS, wireless LAN; etc.): mPC2745TB 800 MHz to 900 MHz cellular telephone (CT2, GSM, etc.) : mPC2746TB
ORDERING INFORMATION
PART NUMBER PACKAGE 6 pin super minimold MARKING...
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