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B l u e t o o t hTM Multi Chip Module
Description The Bluetooth MCM Solution ROK104001 from Infineon Technologies is a complete solution for fast implementation, and cuts your time-to-market. It is a short-range, compact and cost effective radiobaseband module that supports both voice and data transmission and can be implemented in any electronic device. The module includes a baseband processor with 4 Mbit Flash memory, a radio solution, antenna interfaces and application supporting circuitry. The ROK 104 001 comes with either the Embedded Communication Platform (ECP) firmware, providing the full Bluetooth software stack, including profiles for serial communication, or with the basic Bluetooth firmware for signaling at the HCI (Host Controller Interface) level.
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Since this solution is also FCC and ETSI type approved on delivery, cost and time for qualification and type approval is greatly minimized.
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Bluetooth
-Firmware in two versions: -a) Serial Communication (GAP/SPP/DUN/LAN) -b) HCI : Standard Bluetooth Interface Point- to -Multipoint, 7 slaves with the HCI firmware or 3 slaves with embedded stack Power management: PARK, SNIFF & HOLD as well as system power saving Pre-qualified for Bluetooth spec. 1.1 FCC & ETSI type approved Multiple interfaces UART, PCM, Bidirectional serial interface/GPIO, GPIO Voltage regulator included on module highly reduces the input voltage requirements
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Key Features
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A small and cost effective Bluetooth system Output power class 2 Complete Bluetooth function including: - Hardware: Radio, Baseband, Crystal & Memory, Voltage regulator and RC filters
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Note: The Bluetooth trademarks are owned by Bluetoth SIG, Inc. and used by Infineon Technologies under license. www.infineon.com/bluetooth
ROK 104 001
Multi Chip Module
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t h i n k i n g .
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Configuration ECP - Firmware
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ROK 104 001
Serial Communication
8-bit GPIO Bluetooth Core
TM ARM7TDMI
Networking
Host Application ECI Driver
Debug Interface
Base Band Chip
Host
Host Application ECI Driver
Serial Media - UART
Serial Media - UART
AMBA BusSystem
TM
Radio
Flash
ECI
ECI
SDAP
DUN
LAN
SPP
UART1
UART2
PCM
Memory
ROK 104 001
PAN BNEP LM
SDAP SDP
GAP
GAP
RFCOMMSDP L2CAP LM
L2CAP
UART1 (921 kbit/s) UART2 (921 kbit/s)
Antenna Interface 50 Ohm Bluetooth ISM band antenna (2.4 – 2.5 GHz). Module Size The dimensions of the Bluetooth module are: 15.5 x 10.5 x 2.0 mm. UART’s s UART1 supports band rates up to 921 kbit/s with maximum throughput. s UART2 supports baud rates up to 921 kbit/s with reduced throughput. PCM s The PCM interface provides full support for one PCM channel to facilitate voice communication. Bidirectional Serial Interface/GPIO s For example PCM codecs or EEPROM. GPIO
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Traditional host stack Traditional host stack Host application Host application API API
SDAP SDAP
DUN DUN
SPP SPP
LAN LAN
Host Host
GAP GAP
RFCOMM SDP RFCOMM SDP L2CAP L2CAP HCI HCI
Ser.