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ROK104022 Dataheets PDF



Part Number ROK104022
Manufacturers Infineon Technologies AG
Logo Infineon Technologies AG
Description Bluetooth MULTI CHIP MODULE
Datasheet ROK104022 DatasheetROK104022 Datasheet (PDF)

PR B l u e t o o t hTM Multi Chip Module Description The Bluetooth MCM Solution ROK104001 from Infineon Technologies is a complete solution for fast implementation, and cuts your time-to-market. It is a short-range, compact and cost effective radiobaseband module that supports both voice and data transmission and can be implemented in any electronic device. The module includes a baseband processor with 4 Mbit Flash memory, a radio solution, antenna interfaces and application supporting circuitry.

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PR B l u e t o o t hTM Multi Chip Module Description The Bluetooth MCM Solution ROK104001 from Infineon Technologies is a complete solution for fast implementation, and cuts your time-to-market. It is a short-range, compact and cost effective radiobaseband module that supports both voice and data transmission and can be implemented in any electronic device. The module includes a baseband processor with 4 Mbit Flash memory, a radio solution, antenna interfaces and application supporting circuitry. The ROK 104 001 comes with either the Embedded Communication Platform (ECP) firmware, providing the full Bluetooth software stack, including profiles for serial communication, or with the basic Bluetooth firmware for signaling at the HCI (Host Controller Interface) level. OD UCT BR I EF Since this solution is also FCC and ETSI type approved on delivery, cost and time for qualification and type approval is greatly minimized. s Bluetooth -Firmware in two versions: -a) Serial Communication (GAP/SPP/DUN/LAN) -b) HCI : Standard Bluetooth Interface Point- to -Multipoint, 7 slaves with the HCI firmware or 3 slaves with embedded stack Power management: PARK, SNIFF & HOLD as well as system power saving Pre-qualified for Bluetooth spec. 1.1 FCC & ETSI type approved Multiple interfaces UART, PCM, Bidirectional serial interface/GPIO, GPIO Voltage regulator included on module highly reduces the input voltage requirements s s s s Key Features s s s A small and cost effective Bluetooth system Output power class 2 Complete Bluetooth function including: - Hardware: Radio, Baseband, Crystal & Memory, Voltage regulator and RC filters s Note: The Bluetooth trademarks are owned by Bluetoth SIG, Inc. and used by Infineon Technologies under license. www.infineon.com/bluetooth ROK 104 001 Multi Chip Module N e v e r s t o p t h i n k i n g . PR Configuration ECP - Firmware OD UCT BR I EF ROK 104 001 Serial Communication 8-bit GPIO Bluetooth Core TM ARM7TDMI Networking Host Application ECI Driver Debug Interface Base Band Chip Host Host Application ECI Driver Serial Media - UART Serial Media - UART AMBA BusSystem TM Radio Flash ECI ECI SDAP DUN LAN SPP UART1 UART2 PCM Memory ROK 104 001 PAN BNEP LM SDAP SDP GAP GAP RFCOMMSDP L2CAP LM L2CAP UART1 (921 kbit/s) UART2 (921 kbit/s) Antenna Interface 50 Ohm Bluetooth ISM band antenna (2.4 – 2.5 GHz). Module Size The dimensions of the Bluetooth module are: 15.5 x 10.5 x 2.0 mm. UART’s s UART1 supports band rates up to 921 kbit/s with maximum throughput. s UART2 supports baud rates up to 921 kbit/s with reduced throughput. PCM s The PCM interface provides full support for one PCM channel to facilitate voice communication. Bidirectional Serial Interface/GPIO s For example PCM codecs or EEPROM. GPIO s Traditional host stack Traditional host stack Host application Host application API API SDAP SDAP DUN DUN SPP SPP LAN LAN Host Host GAP GAP RFCOMM SDP RFCOMM SDP L2CAP L2CAP HCI HCI Ser.


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