SM1316-L

Semiconductor SM1316-L Chip LED Lamp Features 1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip led Applications LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp Outline Dimensions unit : mm KLM-0006-001 1 SM1316-L Absolute maximum ratings Characteristic Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature 2 1 Symbol PD IF IFP VR Topr Tstg Ratings 70 25 50 4 -25∼80 -30∼100 Unit mW mA mA V ℃ ℃ 240℃ for 5 seconds * Soldering Temperature Tsol *1.Duty ratio = 1/16, Pulse width = 0.1ms *2.Recommended soldering Temperature Profile 2-1) Preheating 100℃ to 150℃ within 2 minutes Soldering 240℃ within 5 seconds Gradual cooling (Avoid quenching) Temp(℃) Peak Temp max 240℃ 1~ 4℃/sec 220℃ 140~ 160℃ Preheating area 120 1~4℃/sec Time(sec) Solder area max. 50sec Peak time max 10sec -2~ -6℃/sec Electrical Characteristics Characteristic Forward Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current *3Half angle θ1/2 Symbol VF IV λP Δλ IR X Y Test Condition IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V IF= 20mA Min - Typ 2.2 7 560 30 ±65 ±70 Max 2.8 10 - Unit V mcd nm nm uA deg *3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity KLM-0006-001 2 Characteristic Diagrams Fig. 1 IF - VF Fig. 2 IV - IF SM1316-L Forward...