Chip LED Lamp
Semiconductor
SM1316
Chip LED Lamp
Features
• • • • • 1.6mm(L)×0.8mm small size surface mount type Thin package of 0.5...
Description
Semiconductor
SM1316
Chip LED Lamp
Features
1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip led Emitting Light Yellow Green (570nm)
Applications
LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
unit :
mm
KLM-8032-002
1
SM1316
Absolute maximum ratings
Characteristic
Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature
2 1
Symbol
PD IF IFP VR Topr Tstg
Ratings
70 25 50 4 -25∼80 -30∼100
Unit
mW mA mA V ℃ ℃
240℃ for 5 seconds * Soldering Temperature Tsol *1.Duty ratio = 1/16, Pulse width = 0.1ms *2.Recommended soldering Temperature Profile 2-1) Preheating 100℃ to 150℃ within 2 minutes Soldering 240℃ within 5 seconds Gradual cooling (Avoid quenching)
Electrical Characteristics
Characteristic
Forward Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current
Symbol
VF IV
Test Condition
IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V
Min.
-
Typ.
2.2 8 570 30 ±65 ±70
Max.
2.8 10 -
Unit
V mcd nm nm uA deg
λP Δλ IR
θ1/2
X-Y X’-Y’
*3Half angle
IF= 20mA
KLM-8032-002
2
Characteristic Diagrams
Fig. 1 IF - VF Fig. 2 IV - IF
SM1316
Luminous Intensity Iv [mcd]
Forward Current IF [mA]
Forward Voltage VF [V]
Forward Current IF [mA]
Fig. 3 IF – Ta
Fig.4 Spectrum Distribution
Current IF [mA]
Forward
Ambient Temperature Ta [℃...
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