TDA8512J

INTEGRATED CIRCUITS DATA SHEET TDA8512J 26 W BTL and 2 × 13 W SE or 4 × 13 W SE power amplifier Preliminary specification File under Integrated Circuits, IC01 2001 Nov 16 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE or 4 × 13 W SE power amplifier CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.3 8.4 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 14.6 14.7 FEATURES APPLICATIONS GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Mode select switch Mode select Built-in protection circuits Short-circuit protection LIMITING VALUES HANDLING THERMAL CHARACTERISTICS DC CHARACTERISTICS AC CHARACTERISTICS APPLICATION INFORMATION Input configuration Output power Power dissipation Supply Voltage Ripple Rejection (SVRR) Switch-on and switch-off PCB layout and grounding Typical performance characteristics 15 16 16.1 16.2 16.3 16.4 17 18 19 PACKAGE OUTLINE SOLDERING TDA8512J Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2001 Nov 16 2 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE or 4 × 13 W SE power amplifier 1 FEATURES Flexible leads Low thermal resistance TDA8512J Requires very few external components High output power Low output offset voltage Bridge-Tied Load (BTL) channel Fixed gain ...