Document
®
TN805/TN815-B
SCR’s
FEATURES ITRMS = 8 A VDRM = 400 V to 800 V IGT ≤ 5 mA and 15 mA DESCRIPTION The TN805/TN815-B serie of Silicon Controlled Rectifiers uses a high performance TOPGLASS PNPN technology. These parts are intended for general purpose applications using mount technology.
K A
A
G
DPAK
ABSOLUTE MAXIMUM RATINGS Symbol IT(RMS) IT(AV) ITSM Parameter RMS on-state current (180° conduction angle) Mean on-state current (180° conduction angle) Non repetitive surge peak on-state current (Tj initial = 25°C) Tc= 105°C Tc= 105°C tp = 8.3 ms tp = 10 ms I2t dI/dt Tstg Tj Tl I2t Value for fusing Critical rate of rise of on-state current dIG /dt = 1 A/µs. IG = 100 mA Storage junction temperature range Operating junction temperature range Maximum lead temperature for soldering during 10s tp = 10ms Value 8 5 73 70 24.5 100 - 40 to + 150 - 40 to + 125 260 A2s A/µs °C °C Unit A A A
Symbol VDRM VRRM
Parameter 400B Repetitive peak-off voltage Tj = 125°C 400
TN805 or TN815 600B 600 700B 700 800B 800
Unit V
August 1998 - Ed: 1A
1/5
TN805/TN815-B
THERMAL RESISTANCES Symbol Rth(j-a) Rth(j-c) Parameter Junction to ambient (S=0.5cm2) Junction to case for D.C Value 70 2.5 Unit °C/W °C/W
GATE CHARACTERISTICS PG (AV)= 1W PGM = 10 W (tp = 20 µs) IGM = 4 A (tp = 20 µs) VRGM = 5 V
ELECTRICAL CHARACTERISTICS Symbol IGT VGT VGD tgt IH IL VTM IDRM IRRM dV/dt Test Conditions VD = 12V (DC) RL= 33Ω VD = 12V (DC) RL= 33Ω VD = VDRM RL = 3.3kΩ VD = VDRM IG = 40mA IT= 150mA IG = 1.2 IGT ITM= 16A tp= 380µs VDRM Rated VRRM Rated Linear slope up to VD=67%VDRM Gate open ITM = 3 x IT(AV) dIG/dt = 0.5A/us Gate open Tj= 25°C Tj= 25°C Tj= 125°C Tj= 25°C Tj= 25°C Tj= 25°C Tj= 25°C Tj= 25°C Tj = 125°C Tj= 125°C Type MAX MAX MIN TYP MAX MAX MAX MAX MAX MIN 50 25 25 1.6 10 2 150 5 1.5 0.2 2 30 30 Value TN805 TN815 15 µA V V µs mA mA V µA mA V/µs Unit
ORDERING INFORMATION
TN
SCR CURRENT
2/5
8
05 - 600
SENSITIVITY
B
PACKAGES : B: DPAK VDRM / VRRM
TN805/815-B
Fig. 1: Maximum average power dissipation versus average on-state current . Fig. 2 : Correlation between maximum average power dissipation and maximum allowable temperatures (T amb and T case) for different thermal resistances heatsink+contact.
P(W) 8 7 6 5 4 3 2 1 0 0 1 2 IT(av)(A) 3 4 5
α
360°
α = 180° α = 120° α = 90° α = 60° α = 30°
D.C.
P(W) 8 7 6 5 4
Rth=37°C/W
Tcase (°C)
105
Rth=0°C/W
α = 180°
110 115 120
3 2 1 0 Tamb(°C) 0 10 20 30 40 50 60 70 80 90 100 110 120 130
125
6
7
Fig. 3-1: Average and D.C. on-state current versus case temperature.
Fig. 3-2: Average and D.C. on-state current versus case temperature.
IT(av)(A) 10
D.C.
IT(av)(A) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0
8 6 4 2 Tcase(°C) 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130
α = 180°
D.C.
α = 180°
Tamb(°C) 0 10 20 30 40 50 60 70 80 90 100 110 120 130
Fig. 4-1: Relative variation of thermal impedance versus pulse duration.
Fig. 4-2: Relative variation of thermal impedance versus pulse duration.
K=[Zth(j-c)/Rth(j-c)] 1.0
K=[Zth(j-a)/Rth(j-a)] 1.00
0.5
0.10
0.2 tp(s) 0.1 1E-3 1E-2 1E-1 1E+0
tp(s) 0.01 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
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TN805/TN815-B
Fig. 5: Relative variation of gate trigger current and holding current versus junction temperature. Fig. 6: Non repetitive surge peak on-state current versus number of cycles.
Igt,IH[Tj]/Ig,IH[Tj=25°C] 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40
80
Igt
ITSM(A) 70 60 50
Tj initial=25°C F=50Hz
IH
40 30 20 10
Tj(°C) -20 0 20 40 60 80 100 120
Number of cycles 1 10 100 1000
0
Fig. 7: Non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and corresponding value of I2t.
Fig. 8: On-state characteristics (maximum values).
ITSM(A),I²t(A²s) 300
Tj initial=25°C ITSM
ITM(A) 100.0
Tj max.: Vto=0.85V Rt=46m
100 50
I²t
10.0
Tj=Tj max.
Tj=25°C
1.0
20 tp(ms) 10 1 2 5 10
VTM(V) 0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Fig. 9: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W) 100 80 60 40 20 S(Cu) (cm²) 0 0 2 4 6 8 10 12 14 16 18 20
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TN805/815-B
PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. A A1 A2 B B2 C C2 D E G H L2 L4 V2 0.60 0° Millimeters Min. Typ. 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 0.80 1.00 0.023 8° 0° Max 2.40 0.086 1.10 0.035 0.23 0.001 0.90 0.025 5.40 0.204 0.60 0.017 0.60 0.018 6.20 0.236 6.60 0.251 4.60 0.173 10.10 0.368 0.031 0.039 8° Inches Min. Typ. Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397
FOOT PRINT DIMENSIONS (in millimeters)
6.7
WEIGHT : 0.30g MARKING TYPE MARKING TN8 05x0 TN8 15x0
6.7
T805- x00B T815-x00B
6.7 3 1.6 2.3 2.3 1.6
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