Power MOSFET
PD-93998A
IRF5851
HEXFET® Power MOSFET
l l l l l
Ultra Low On-Resistance Dual N and P Channel MOSFET Surface Mount Ava...
Description
PD-93998A
IRF5851
HEXFET® Power MOSFET
l l l l l
Ultra Low On-Resistance Dual N and P Channel MOSFET Surface Mount Available in Tape & Reel Low Gate Charge
N-Ch
G1 1 6 D1
P-Ch -20V
S2
2
5
S1
VDSS
20V
G2
3
4
D2
RDS(on) 0.090Ω 0.135Ω
Description
These N and P channel MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications. This Dual TSOP-6 package is ideal for applications where printed circuit board space is at a premium and where maximum functionality is required. With two die per package, the IRF5851 can provide the functionality of two SOT-23 packages in a smaller footprint. Its unique thermal design and RDS(on) reduction enables an increase in current-handling capability.
TSOP-6
Absolute Maximum Ratings
Parameter
VDS ID @ TA = 25°C ID @ TA = 70°C IDM PD @TA = 25°C PD @TA = 70°C VGS TJ, TSTG Drain-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Junction and Storage Temperature Range
Max.
N-Channel 20 2.7 2.2 11 0.96 0.62 7.7 ± 12 -55 to + 150 P-Channel -20 -2.2 -1.7 -9.0
Units
A
W mW/°C V °C
Thermal Resistance
Parameter
RθJA Maximum Junction-to-Ambient
Typ.
–––
Max.
130
Units
°C/W
www.irf.com
1
2/...
Similar Datasheet