Chip LED Lamp
Semiconductor
SB1314E-V
Chip LED Lamp
Features
• 1.6mm(L)×0.8mm small size surface mount type • Thin package of 0.4mm(...
Description
Semiconductor
SB1314E-V
Chip LED Lamp
Features
1.6mm(L)×0.8mm small size surface mount type Thin package of 0.4mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Emitting Light Blue(470nm)
E ; ESD Protected (±2.0kv, 3 times @100pF, 1.5kΩ)
Applications
LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
unit : mm
KLB-2006-001
1
SB1314E-V
Absolute maximum ratings
Characteristic
Power Dissipation Forward Current * Peak Forward Current Operating Temperature Storage Temperature
2 1
Symbol
PD IF IFP Topr Tstg
Ratings
75 20 50 -25∼80 -30∼100
Unit
mW mA mA ℃ ℃
240℃ for 5 seconds * Soldering Temperature Tsol *1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile 2-1) Preheating 100℃ to 150℃ within 2 minutes Soldering 240℃ within 5 seconds Gradual cooling (Avoid quenching)
Electrical Characteristics
Characteristic
*3Forward Voltage
*4Luminous Intensity *6Peak Wavelength
Spectrum Bandwidth
Symbol
VF IV
Test Condition
IF= 5mA IF= 5mA IF= 5mA IF= 5mA
Min
2.6 5 460 -
Typ
3.1 22 470 35 ±65 ±70
Max
3.5 40 485 -
Unit
V mcd nm nm deg
λP Δλ
θ1/2 X Y
*5Half Angle
IF= 5mA
KLB-2006-001
2
SB1314E-V
*3. Forward Voltage Maximum tolerance for ±0.1V *4. Luminous Intensity Maximum tolerance for each Grade Classification limit is ±18% (The test result of IF=20mA is only for reference) *5. θ1/2 is the off-axis angle where the luminous intensity is ...
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