Power MOSFET
PD- 93768A
Si4435DY
HEXFET® Power MOSFET
l l l l
Ultra Low On-Resistance P-Channel MOSFET Surface Mount Available in T...
Description
PD- 93768A
Si4435DY
HEXFET® Power MOSFET
l l l l
Ultra Low On-Resistance P-Channel MOSFET Surface Mount Available in Tape & Reel
S
1
8 7
A D D D D
S
S G
2
VDSS = -30V RDS(on) = 0.020Ω
3
6
4
5
Description
These P-channel HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications.. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infrared, or wave soldering techniques.
T o p V ie w
SO-8
Absolute Maximum Ratings
Parameter
VDS ID @ TA = 25°C ID @ TA= 70°C IDM PD @TA = 25°C PD @TA = 70°C VGS TJ, TSTG Drain- Source Voltage Continuous Drain Current, VGS @ -10V Continuous Drain Current, VGS @ -10V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Junction and Storage Temperature Range
Max.
-30 -8.0 -6.4 -50 2.5 1.6 0.02 ± 20 -55 to + 150
Units
V A
W W/°C V °C
Thermal Resistance
Parameter
RθJA Maximum Junction-to-Ambient
Max.
50
Units
°C/W
www.irf.com
1
10/14/99
Si4435DY
Electrical Characteristics @ TJ = 25°C (unless othe...
Similar Datasheet