Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM
K5A3x40YT(B)C
Document Title
Multi-Chip Package MEMORY
Preliminary MCP MEMORY
32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash...
Description
K5A3x40YT(B)C
Document Title
Multi-Chip Package MEMORY
Preliminary MCP MEMORY
32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM
Revision History
Revision No. History
0.0 Initial Draft
Draft Date
November 6, 2002
Remark
Preliminary
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.
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Revision 0.0 November 2002
K5A3x40YT(B)C
Multi-Chip Package MEMORY
Preliminary MCP MEMORY
32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM
FEATURES
Power Supply voltage : 2.7V to 3.3V Organization - Flash : 4,194,304 x 8 / 2,097,152 x 16 bit - SRAM : 524,288 x 8 / 262,144 x 16 bit Access Time (@2.7V) - Flash : 70 ns, SRAM : 55 ns Power Consumption (typical value) - Flash Read Current : 14 mA (@5MHz) Program/Erase Current : 15 mA Standby mode/Autosleep mode : 5 µA Read while Program or Read while Erase : 25 mA - SRAM Operating Current : 20 mA Standby Current : 0.5 µA Secode(Security Code) Block : Extra 64KB Block (Flash) Block Group Protection / Unprotection (Flash) Flash Bank Size : 8Mb / 24Mb , 16Mb / 16Mb Flash Endurance : 100,000 Program/Erase Cycles Minimum SRAM Data Retention : 1.5 V (min.) Industrial Temperature : -40°C ~ 85°C Package : 69-ball TBGA Type - 8...
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