Preliminary Data Sheet
FEATURES ♦ 21 dBm Output Power at 1-dB Compression at 18 GHz ♦ 12.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency ♦ Source Vias to Backside Metallization
FPDA200V
HIGH PERFORMANCE PHEMT WITH SOURCE VIAS
GATE BOND PAD
DRAIN BOND PAD
DIE SIZE: 15.6X13.2 mils (395x335 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 3.1X3....
