DS21Q552

DALLAS SEMICONDUCTOR Quad T1/E1 Transceiver (5V) Quad T1/E1 Transceiver (3.3V) FEATURES P Four (4) Completely Independent T1 or E1 Transceivers In One Small 27mm x 27mm Package Each Transceiver Contains a Short & Long Haul Line Interface Plus a Full Featured Framer with Alarm Detection/Generation, Elastic Stores, Hardware Based Signaling Support, Per DS0 Channel Control and HDLC Controller Each Multi-Chip Module (MCM) Contains Four Die of: DS21352 (DS21Q352) DS21552 (DS21Q552) DS21354 (DS21Q354) DS21554 (DS21Q554) Selection Guide: Supply 3.3V 5V 3.3V 5V Preliminary DS21Q552/DS21Q554 DS21Q352/DS21Q354 T1 T1 E1 E1 Device DS21Q352 DS21Q552 DS21Q354 DS21Q554 See the Specific DS21352/DS21552 and DS21354/DS21554 Data Sheets for Details on their Feature Set and Operation All Four T1 or E1 Transceivers Can be Concatenated into a Single 8.192MHz Backplane Data Stream IEEE 1149.1 JTAG-Boundary Scan Architecture DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are Pin Compatible to Allow the Same Footprint to Support T1 and E1 Applications 256–lead MCM BGA package (27mm X 27mm) Low Power 5V CMOS or Low Power 3.3V CMOS with 5V Tolerant Input & Outputs DESCRIPTION The Quad T1 and E1 Transceiver MCMs offer a high density packaging arrangement for the DS21352/DS21552 T1 Single-Chip Transceivers and the DS21354/DS21554 E1 Single-Chip Transceivers. Four silicon die of one of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Fig...