FCD4B14CCB

Features Sensitive Layer Over a 0.8 µm CMOS Array Image Zone: 0.4 x 14 mm = 0.02" x 0.55" Image Array: 8 x 280 = 2240 pixels Pixel Pitch: 50 µm x 50 µm = 500 dpi Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second Die Size: 1.7 x 17.3 mm Operating Voltage: 3V to 5.5V Naturally Protected Against ESD: > 16 kV Air Discharge Power Consumption: 20 mW at 3.3V, 1 MHz, 25°C Operating Temperature Range: 0°C to +70°C: C suffix Resistant to Abrasion: >1 Million Finger Sweeps Chip-On-Board (COB) package or 20-lead Ceramic DIP available for development, with Specific Protective Layer Applications PDA (Access Control, Data Protection) Cellular Phones, SmartPhone (Access e-business) Notebook, PC-add on (Access Control, e-business) PIN Code Replacement Automated Teller Machine, POS Building Access Electronic Keys (Cars, Home,...) Portable Fingerprint Imaging for Law Enforcement TV Access Figure 1. Fingerchip Packages Step for easy integration Sensing area Wire protection (not drawn) Thermal Fingerprint Sensor with 0.4 mm x 14 mm (0.02" x 0.55") Sensing Area and Digital Output (On-chip ADC) FCD4B14 FingerChip™ Chip-on-Board Package (COB) 20-pin, 0.3" Dual-Inline Ceramic Package (DIP20) Rev. 1962C–01/02 1 Table 1. Pin Description For DIP Ceramic Package Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Name GND AVE TPP VCC RST OE De0 De1 De2 De3 FPL Do3 Do2 Do1 Do0 GND ACKN PCLK TPE AVO Type GND Analog output Power Power ...